Light signal processing system
View Patent ↗There are provided a sealing insulating film that is formed on a substrate and melted at a first heating temperature to have a flowability, and external terminals that are formed on the substrate, and connected to other electronic device at a second heating temperature higher than the first heating temperature, and surrounded by the sealing insulating film.
1. An electronic device comprising:
a sealing insulating film formed on a substrate, the sealing insulating film having flowability at a first temperature;
external terminals formed on the substrate, the external terminals being partially surrounded by the sealing insulating film; and
a substance connected to a portion of the external terminals not surrounded by the sealing insulating film, the substance having a melting point at a second temperature higher than the first temperature,
wherein the external terminal contacts an other electronic device via the substance.
2. An electronic device according to claim 1 , wherein the substrate is a semiconductor substrate on which semiconductor elements are formed.
3. An electronic device according to claim 1 , wherein the sealing insulating film is formed of resin material that is thermoplastic and has the flowability at a temperature in excess of a glass transition temperature and is solidified after the resin material is cooled below the glass transition temperature, and the substance connecting the external terminals and the other electronic device is a conductive adhesive having a melting point which is higher than the glass transition temperature.
4. An electronic device according to claim 1 , wherein exposed portions of the external terminals from the sealing insulating film are formed like a pin, a ball, or a flat surface.
5. An electronic device according to claim 1 , wherein the substance connecting the external terminals to the other electronic device is a conductive adhesive film having a melting point of the second temperature.
6. An electronic device according to claim 5 , wherein the conductive adhesive film is solder, solder paste, or conductive resin.
7. An electronic device according to claim 6 , wherein a melting temperature of the sealing insulating film is lower than a melting point of the solder.
8. An electronic device according to claim 5 , wherein an underlying metal film is formed between the external terminals and the conductive adhesive film.
9. An electronic device according to claim 8 , wherein the underlying metal film is also formed on surfaces of the external terminals, which are not covered with the conductive adhesive film.
10. An electronic device according to claim 1 , wherein the external terminals are connected to conductive pads formed on the substrate.
11. An electronic device according to claim 1 , wherein wiring patterns to which the external terminals are connected are formed on the substrate, and peripheral areas of connected portions between the wiring patterns and the external terminals are covered with the sealing insulating film.
12. An electronic device according to claim 11 , wherein a non-thermoplastic insulating film is formed between the sealing insulating film and the wiring patterns.
13. An electronic device according to any one of claim 1 to claim 12 , wherein the second heating temperature is higher than the first heating temperature.
14. An electronic device according to claim 1 , wherein a non-thermoplastic insulating film is formed between the sealing insulating film and the substrate.
15. An electronic device comprising:
a sealing insulating film formed on a substrate, and having a melting point at a first temperature;
external terminals formed on the substrate, and being partially coated by the sealing insulating film; and
wherein the external terminals have a melting point at a second temperature higher than the first temperature, and contact an other electronic device.