IP Library › Granted Patent US 6,469,398
Granted Patent Utility
US 6,469,398 · Confirmation No. 8187

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Inventor: Tetsuji Hori
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2018-03-28 SOL.NTC.SUIT Report on the filing or determination of an action regarding a patent 1 View
2017-11-01 SOL.NTC.SUIT Report on the filing or determination of an action regarding a patent 1 View
2002-03-21 TRNA Transmittal of New Application 2 View
2002-03-21 ADS Application Data Sheet 1 View
2002-03-21 SPEC Specification 31 View
2002-03-21 CLM Claims 8 View
2002-03-21 ABST Abstract 1 View
2002-03-21 DRW Drawings-only black and white line drawings 10 View
2002-03-21 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,469,398
App. No.
10/101,730
Filed
2002-03-21
Granted
2002-10-22
Pub. No.
US20020140067A1
Art Unit
2815
PTA
-126 days