IP Library › Assignment 041970/0622
Patent Assignment
Reel/Frame 041970/0622

Assignment of Assignor's Interest

Recorded: 2017-04-11 Pages: 5
Assignor
TOSHIBA CORPORATION
Executed: 2016-11-30
Assignee
NORTH PLATE SEMICONDUCTOR, LLC
39555 ORCHARD HILL PLACE, SUITE 600, NOVI, MICHIGAN, 48375
Covered Properties (15)
Semiconductor Device
Patent: 6,501,129 →
Application: 09/820,369 →
Publication: US 2001/0025984
Semiconductor Device and Method of Manufacturing the Same
Patent: 6,620,653 →
Application: 09/961,361 →
Publication: US 2002/0048855
High Breakdown Voltage Semiconductor Device
Patent: 6,667,515 →
Application: 10/053,660 →
Publication: US 2002/0100935
High Voltage Semiconductor Device Capable of Increasing a Switching Speed
Patent: 6,617,641 →
Application: 10/059,186 →
Publication: US 2002/0100934
Semiconductor Package and Manufacturing Method Thereof
Patent: 6,469,398 →
Application: 10/101,730 →
Publication: US 2002/0140067
Semiconductor Device Having Junction-Termination Structure of Resurf Type
Patent: 6,765,239 →
Application: 10/187,369 →
Publication: US 2003/0006497
Trench Gate Type Semiconductor Device and Fabricating Method of the Same
Patent: 6,717,210 →
Application: 10/289,339 →
Publication: US 2004/0041207
Semiconductor Device and Method of Manufacturing the Same
Patent: 6,627,499 →
Application: 10/305,197 →
Publication: US 2003/0075760
Punch Through Type Power Device
Patent: 6,686,613 →
Application: 10/383,515 →
Publication: US 2003/0168718
Power Semiconductor Device
Patent: 6,936,893 →
Application: 10/677,260 →
Publication: US 2004/0238884
Semiconductor Device
Patent: 7,075,168 →
Application: 11/016,810 →
Publication: US 2005/0161768
Insulated Gate Semiconductor Device with Small Feedback Capacitance and Manufacturing Method Thereof
Patent: 7,459,751 →
Application: 11/216,014 →
Publication: US 2006/0049456
Semiconductor Device
Patent: 7,492,031 →
Application: 11/434,185 →
Publication: US 2006/0202308
Semiconductor Device and Method for Manufacturing the Same
Patent: 7,700,998 →
Application: 12/164,389 →
Publication: US 2009/0014788
Semiconductor Device and Method for Manufacturing the Same
Patent: 8,173,509 →
Application: 12/714,586 →
Publication: US 2010/0151644
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 25, 2001
From: MATSUDAI, TOMOKO; HATTORI, HIDETAKA; NAKAGAWA, AKIO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 012202/0769 →
Assignment of Assignor's Interest Jan 24, 2002
From: INOUE, TOMOKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 012518/0401 →
Assignment of Assignor's Interest Mar 19, 2004
From: TANAKA, MASAHIRO; UMEKAWA, SHINICHI; MATSUDA, TADASHI; YAMAGUCHI, MASAKAZU
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 015112/0811 →
Assignment of Assignor's Interest Apr 6, 2005
From: SUGIYAMA, KOICHI; INOUE, TOMOKI; NINOMIYA, HIDEAKI; YAMAGUCHI, MASAKAZU
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 016433/0907 →
Security Interest Aug 8, 2005
From: SMART DISC, INC.
To: KNOBBE, MARTENS, OLSON & BEAR, LLP
Reel/Frame 016622/0208 →
Assignment of Assignor's Interest Sep 1, 2005
From: SUGIYAMA, KOICHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 016951/0554 →
Assignment of Assignor's Interest Sep 26, 2008
From: OKUMURA, HIDEKI; NOGAMI, TAKAYOSHI; MISAWA, HIROTO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 021591/0967 →
License Sep 11, 2018
From: NORTH PLATE SEMICONDUCTOR, LLC
To: DIODES INCORPORATED
Reel/Frame 046843/0081 →