IP Library Granted Patent US 6,573,122
Granted Patent Utility
US 6,573,122 · Confirmation No. 6255

WAFER LEVEL INSULATION UNDERFILL FOR DIE ATTACH

Inventor: Martin Standing
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Code Description Pages PDF
2002-05-15 TRNA Transmittal of New Application 3 View
2002-05-15 DRW Drawings-only black and white line drawings 4 View
2002-05-15 OATH Oath or Declaration filed 1 View
2002-03-26 TRNA Transmittal of New Application 1 View
2002-03-26 ADS Application Data Sheet 1 View
2002-03-26 SPEC Specification 7 View
2002-03-26 CLM Claims 3 View
2002-03-26 ABST Abstract 1 View
2002-03-26 DRW Drawings-only black and white line drawings 4 View
2002-03-26 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,573,122
App. No.
10/106,927
Filed
2002-03-26
Granted
2003-06-03
Pub. No.
US20020146861A1
Art Unit
2822
PTA
-65 days