IP Library › Patent Application 60279102
Patent Application Provisional
App. No. 60/279,102 · Confirmation No. 9490

Flip fet with preloaded wafer level thermoplastic underfill

Inventor: Martin Standing
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-03-28 TRNA Transmittal of New Application 1 View
2001-03-28 SPEC Specification 2 View
2001-03-28 CLM Claims 1 View
2001-03-28 ABST Abstract 1 View
2001-03-28 DRW Drawings-only black and white line drawings 1 View
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Quick Facts
App. No.
60/279,102
Filed
2001-03-28