Method and apparatus for testing a circuit using a die frame logic analyzer

1. An apparatus comprising:

a programmable die frame, logic analyzer unit, at least a first portion of the programmable die frame logic analyzer unit being provided in a die frame, the programmable die frame logic analyzer unit to test a function of an integrated circuit die on a wafer that includes the die frame.

2. The apparatus of claim 1 wherein the programmable die frame logic analyzer unit comprises:

a logic analyzer control unit; and

logic analyzer input/output circuitry coupled to the logic analyzer control unit.

3. The apparatus of claim 2 wherein the logic analyzer control unit comprises a signal typing control unit to enable testing of a plurality of different signal types.

4. The apparatus of claim 2 wherein the logic analyzer control unit comprises:

a pattern generator unit to generate a test pattern for the integrated circuit die; and

a programmable state machine coupled to the pattern generator unit to control a test sequence during testing of the integrated circuit die.

5. The apparatus of claim 4 further including a pattern recognition unit coupled to the programmable state machine, the pattern recognition unit to recognize a pattern during testing of the integrated circuit die and to cause execution of a triggerable program in response to recognizing the pattern.

6. The apparatus of claim 1 further comprising:

a clock to be coupled to the programmable die frame logic analyzer unit; and

programmable clock delay logic to be coupled to the clock and the programmable logic analyzer unit, the programmable clock delay logic being programmable by the die frame logic analyzer unit to generate a shifted clock signal.

7. The apparatus of claim 1 wherein the programmable die frame logic analyzer unit is capable of being clocked by a clock external to the wafer.

8. The apparatus of claim 1 , wherein the programmable die frame logic analyzer unit is to be coupled to the integrated circuit die using an external probe.

9. The apparatus of claim 8 wherein, the programmable die frame logic analyzer unit is to be coupled to multiple integrated circuit die using the external probe.

10. A method comprising:

retrieving a signal vector from a memory;

applying the signal vector to an input of a first circuit on an integrated circuit to be tested in response to a test signal from a programmable logic analyzer unit, at least a portion of which is provided in a die frame of a wafer that includes the integrated circuit; and

sensing a response vector from an output of the first circuit.

11. The method of claim 10 further comprising:

coupling the logic analyzer unit via an external probe to multiple integrated circuits to be analyzed.

12. The method of claim 10 further comprising:

coupling the logic analyzer unit to the integrated circuit using an external probe.

13. The method of claim 12 further comprising:

shifting an edge of a clock signal using circuitry on the integrated circuit to generated a shifted clock signal,

wherein applying the signal vector comprises using the shifted clock signal.

14. The method of claim 13 further comprising:

measuring a response time of the circuit in reference to the shifted clock signal.

15. The method of claim 13 further comprising:

recognizing a predetermined signal pattern; and

triggering a program stored on the integrated circuit in response to recognizing the predetermined signal pattern.

16. The method of claim 10 further comprising:

executing a program stored on the logic analyzer unit after manufacture of the integrated circuit to test a function of the integrated circuit.

17. The method of claim 10 further comprising:

storing the response vector in a memory.

18. A wafer comprising:

a plurality of integrated circuit dice; and

a programmable die frame logic analyzer unit, at least a portion of which is provided in a die frame area outside the integrated circuit dice.

19. The wafer of claim 18 wherein

the die frame logic analyzer unit is to be coupled to at least one of the integrated circuit dice using an external probe.

20. The wafer of claim 19 wherein

the external probe comprises a memory to store at least one of signal vectors, response vectors, reference vectors and a triggerable program.

21. The wafer of claim 19 wherein

the external probe is coupled to a system by an input/output cable, the system comprising at least one input device and at least one output device, the input device to enable a user to control the logic analyzer unit, the output device to provide results of testing of an integrated circuit die on the wafer by the logic analyzer unit.

22. The wafer of claim 19 wherein multiple die frame logic analyzer units are provided, at least a portion of each of the multiple die frame logic analyzer units to be provided in the die frame area.

23. The wafer of claim 19 wherein the die frame logic analyzer unit comprises

a logic analyzer control unit implemented using a processor core.

24. The wafer of claim 23 wherein

the processor core is a microprocessor core.

25. The wafer of claim 23 wherein

the logic analyzer control unit is programmable to control testing of the integrated circuit dice.

26. The wafer of claim 23 wherein

the logic analyzer control unit comprises a signal typing control unit to enable testing of a plurality of different signal types.

27. The wafer of claim 23 wherein the logic analyzer control unit comprises:

a pattern generator unit to generate a test pattern for the integrated circuit die; and

a programmable state machine coupled to the pattern generator unit to control a test sequence during testing of the integrated circuit die.

28. The wafer of claim 27 further comprising

a pattern recognition unit coupled to the programmable state machine, the pattern recognition unit to recognize a pattern during testing of the integrated circuit die and to cause execution of a triggerable program in response to recognizing the pattern.

29. The wafer of claim 18 further comprising:

a clock to be coupled to the programmable die frame logic analyzer unit; and

programmable clock delay logic to be coupled to the clock and the programmable logic analyzer unit, the programmable clock delay logic being programmable by the die frame logic analyzer unit to generate a shifted clock signal.

30. The wafer of claim 19 wherein the programmable die frame logic analyzer unit is capable of being clocked by a clock external to the wafer.

31. The wafer of claim 30 wherein the clock external to the wafer is provided on the external probe.