IP Library Granted Patent US 6,853,474
Granted Patent B2
US 6,853,474 · App. 10/117,554 · Granted Feb 8, 2005

Process for fabricating optical switches

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Quick Facts
Patent No.
US 6,853,474
App. No.
10/117,554
Granted
Feb 8, 2005
Kind
B2
Abstract

A process for fabricating micro-acousto-optic modulators using microelectronics fabrication technology. First, a set of trenches is etched into a substrate. Then, a transducer material is deposited into these trenches, followed by removal of any transducer material located above the surface of the substrate. Next, a second set of trenches is etched on both sides of the transducer material, between the transducer material and the substrate. Then, an electrode material is deposited into the second set of trenches. Finally, any electrode material located above the surface of the substrate is removed such that the surface of the substrate is co-planar with the electrode and transducer materials.

Claims (16)

1. A micro-acousto-optic modulator comprising:

a substrate having at least one inlay further comprising

a) a first layer of electrode material;

b) a layer of transducer material; and

c) a second layer of electrode material;

wherein the layer of transducer material is located between the first layer of electrode material and the second layer of electrode material.

2. The substrate in claim 1 is selected from the group consisting of single crystal substrate and polycrystalline substrate.

3. An optical switch comprising the micro-acousto-optic modulator of claim 1 wherein, when an AC voltage is applied to the layer of transducer material, an acoustic wave forms in the substrate causing diffraction of a light signal passing through the substrate.

4. The micro-acousto-optic modulator of claim 1 having a thickness of less than 3 mm.

5. A micro-acousto-optic modulator comprising:

a) a substrate having an exposed surface;

b) a first layer of electrode material attached to the surface of the substrate;

c) a layer of transducer material attached to the first layer of electrode material; and

d) a second layer of electrode material attached to the layer of transducer material, wherein the first layer of electrode material, the layer of transducer material and the second layer of electrode material are embedded within a material layer of electrically insulating material associated with the exposed surface of the substrate.

6. An optical switch comprising the micro-acousto-optic modulator of claim 5 wherein, when an AC voltage is applied to the layers of electrode material, an acoustic wave forms in the substrate causing diffraction of a light signal passing through the substrate.

7. The micro-acousto-optic modulator of claim 5 having a thickness of less than 3 mm.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2002
From: YU, CHRIS C.; BRUSIC, VLASTA
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 012697/0731 →