IP Library Granted Patent US 6,855,476
Granted Patent B2
US 6,855,476 · App. 10/117,693 · Granted Feb 15, 2005

Photoacid generators for use in photoresist compositions

Assignee: Arch Specialty Chemicals, Inc.
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Quick Facts
Patent No.
US 6,855,476
App. No.
10/117,693
Granted
Feb 15, 2005
Kind
B2
Abstract

A photoacid compound having the following general structure: R—O(CF 2 ) n SO 3 X wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, or glycidyl; and X is selected from the group consisting of: organic cations and covalently bonded organic radicals.

Claims (75)

1. A photoacid compound having the following general structure:

R—O(CF 2 ) n SO 3 X

wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl; and X is covalently bonded organic radicals selected from the group consisting of: sulfonic esters of polyhydroxyphenols and alpha sulfonyloxyketones.

2. A photoacid compound according to claim 1 wherein the compound is a sulfonic acid ester of polyhydroxyphenol having the general structure:

wherein n is an integer between about 1 to 4; and R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl.

3. A photoacid compound according to claim 1 wherein the compound is an alpha sulfonyloxyketone having the general formula:

wherein n is an integer between about 1 to 4; and R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, and the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl; and R 11 and R 12 are substituted or unsubstituted alkyl or aryl.

4. A photoresist composition comprising:

a polymer; and

a photoacid compound having the following general structure:

R—O(CF 2 ) n SO 3 X

 wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl; and X is covalently bonded organic radicals selected from the group consisting of: sulfonic esters of polyhydroxyphenols and alpha sulfonyloxyketones.

5. A photoresist composition according to claim 4 wherein the photoactive compound is a compound of the following general structure:

wherein n is an integer between about 1 to 4; and R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl.

6. A photoresist composition according to claim 4 wherein the photoactive compound is an alpha sulfonyloxyketone having the general formula:

wherein n is an integer between about 1 to 4; and R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, and the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl; and R 11 and R 12 are substituted or unsubstituted alkyl or aryl.

7. A photoresist composition according to claim 4 wherein the polymer is a silicon-containing polymer having alkali solubilizing groups protected by an acid sensitive group.

8. A photoresist composition according to claim 7 wherein the polymer has the units

in the polymer.

9. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 4 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

10. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 5 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

11. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 6 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

12. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 7 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

13. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 8 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

14. A photoresist composition comprising:

a polymer that is a silicon-containing polymer having alkali solubilizing groups protected by an acid sensitive group; and

a photoacid compound having the following general structure:

R—O(CF 2 ) n SO 3 X

 wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl; and X is selected from the group consisting of: organic iodonium cations, organic sulfonium cations except trimethyl sulfonium cations, and covalently bonded organic radicals selected from the group consisting of: oxime sulfonates, N-hydroxyimide sulfonates, substituted or unsubstituted nitrobenzyl esters, sulfonic esters of polyhydroxyphenols and alpha sulfonyloxyketones.

15. A photoresist composition according to claim 14 wherein the silicon-containing polymer has the units

in the polymer.

16. A photoresist composition according to claim 14 wherein the photoacid compound is a compound wherein the sulfonium cation is selected from the group consisting of:

wherein R 1 , R 2 and R 3 are not all simultaneously methyl, and

where R 1 , R 2 , and R 3 are individually selected from substituted or unsubstituted aryl and alkyl; R 4 , R 5 , R 6 , R 7 , R 8 , R 4′ , R 5′ , R 6′ , R 7′ and R 8′ are individually selected from the group consisting of: branched, linear, or cyclic alkyl, branched, linear, or cyclic alkoxy, halogen, hydrogen, OCO 2 G, OCH 2 CO 2 G, and OG, where G is an acid sensitive group.

17. A photoresist composition according to claim 14 wherein the photoactive compound wherein said sulfonium cation is selected from the group consisting of:

18. A photoresist composition according to claim 14 wherein in the photoactive compound the oxime sulfonate has the general structure:

wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl, and R 4 , R 5 , R 6 , R 7 and R 8 are individually selected from the group consisting of: branched, linear, or cyclic alkyl, branched, linear, or cyclic alkoxy, halogen, hydrogen, OCO 2 G, OCH 2 CO 2 G, and OG, where G is an acid sensitive group.

19. A photoresist composition according to claim 14 wherein in the photoactive compound the N-hydroxyimide sulfonate has the general formula:

where D and E are independently H, substituted or unsubstituted aryl or together compose a substituted or unsubstituted bicyclic, or tricyclic alicyclic ring system; n is an integer between about 1 to 4; and R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl.

20. A photoresist composition according to claim 14 wherein in the photoactive compound the nitrobenzyl ester has the formula:

wherein R 10 is an electron withdrawing substituent; n is an integer between about 1 to 4; and R is selected from the group consisting of: substituted or unsubstituted C 1 -C 12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF 2 ) p O) m (CF 2 ) q — wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, and glycidyl.

21. A photoresist composition according to claim 14 wherein the photoactive compound is selected from the group consisting of:

22. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 14 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

23. A method for fabricating an Integrated circuit which comprises:

depositing a photoresist composition of claim 15 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

24. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 16 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

25. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 17 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

26. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 18 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

27. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 19 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

28. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 20 on a substrate, irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

29. A method for fabricating an integrated circuit which comprises:

depositing a photoresist composition of claim 21 on a substrate,

irridating said photoresist composition, thereby generating a fluorinated alkyl sulfonic acid with a short perfluoroalkyl chain attached to an ether linkage.

Assignments (2)
MERGER Recorded Oct 5, 2011
From: ARCH SPECIALTY CHEMICALS, INC.
To: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
Reel/Frame 027017/0882 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2002
From: FERREIRA, LAWRENCE; BLAKENEY, ANDREW J.; SPAZIANO, GREGORY DOMENIC; DIMOV, OGNIAN; KOCAB, J. THOMAS; HATFIELD, JOHN P.
To: ARCH SPECIALITY CHEMICALS, INC.
Reel/Frame 013118/0746 →
Continuity (2)
Provisional Application 6028165200 · Apr 5, 2001
Related Publication 20020197558A1 · Dec 26, 2002