IP Library Granted Patent US 6,818,532
Granted Patent Utility
US 6,818,532 · Confirmation No. 4148

METHOD OF ETCHING SUBSTRATES

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Code Description Pages PDF
2004-08-30 IFEE Issue Fee Payment (PTO-85B) 3 View
2002-04-09 TRNA Transmittal of New Application 1 View
2002-04-09 ADS Application Data Sheet 4 View
2002-04-09 SPEC Specification 20 View
2002-04-09 CLM Claims 8 View
2002-04-09 ABST Abstract 1 View
2002-04-09 DRW Drawings-only black and white line drawings 4 View
2002-04-09 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,818,532
App. No.
10/118,318
Filed
2002-04-09
Granted
2004-11-16
Pub. No.
US20030190770A1
Art Unit
2814
PTA
-355 days