Patent Assignment
Reel/Frame 031410/0169
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2013-10-15
Received: 2013-10-15
Pages: 8
Assignor
LG ELECTRONICS, INC.
Executed: 2013-09-16
Assignee
LG INNOTEK CO. LTD.
SEOUL SQUARE 20F, NAMDAEMUNNO 5-GA, JUNG-GU, SEOUL, KRX, 100-174, KOREA, REPUBLIC OF
Covered Applications
(50)
DIODE HAVING VERTICAL STRUCTURE
App. No. 13/951,344
→
VERTICAL TOPOLOGY LIGHT EMITTING DEVICE
App. No. 13/934,852
→
THIN FILM LIGHT EMITTING DIODE
App. No. 13/855,637
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 13/750,376
→
VERTICAL TOPOLOGY LIGHT EMITTING DEVICE
App. No. 13/678,333
→
METHOD OF MAKING DIODE HAVING REFLECTIVE LAYER
App. No. 13/550,097
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 13/216,531
→
THIN FILM LIGHT EMITTING DIODE
App. No. 13/110,545
→
DIODE HAVING HIGH BRIGHTNESS AND METHOD THEREOF
App. No. 13/074,566
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 13/047,371
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 12/941,627
→
METHOD OF MAKING DIODE HAVING REFLECTIVE LAYER
App. No. 12/841,674
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 12/840,840
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 12/797,335
→
THIN FILM LIGHT EMITTING DIODE
App. No. 12/654,992
→
THIN FILM LIGHT EMITTING DIODE
App. No. 12/654,988
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 12/654,894
→
THIN FILM LIGHT EMITTING DIODE
App. No. 12/591,164
→
Thin film light emitting diode
App. No. 12/591,165
→
DIODE HAVING HIGH BRIGHTNESS AND METHOD THEREOF
App. No. 12/461,681
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 12/458,703
→
A VERTICAL TOPOLOGY LIGHT EMITTING DEVICE USING A CONDUCTIVE SUPPORT STRUCTURE
App. No. 12/285,557
→
THIN FILM LIGHT EMITTING DIODE
App. No. 11/978,680
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 11/896,772
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 11/896,307
→
METHOD OF FABRICATING VERTICAL DEVICES USING A METAL SUPPORT FILM
App. No. 11/882,575
→
METHOD OF MAKING DIODE HAVING REFLECTIVE LAYER
App. No. 11/713,045
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 11/593,470
→
THIN FILM LED
App. No. 11/544,645
→
METHOD OF FABRICATING VERTICAL DEVICES USING A METAL SUPPORT FILM
App. No. 11/497,268
→
VERTICAL TOPOLOGY LIGHT EMITTING DEVICE
App. No. 11/311,229
→
METHOD OF FABRICATING VERTICAL DEVICES USING A METAL SUPPORT FILM
App. No. 11/311,230
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 11/298,507
→
DIODE HAVING HIGH BRIGHTNESS AND METHOD THEREOF
App. No. 11/247,225
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 11/232,956
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 11/232,957
→
METHOD OF MAKING DIODE HAVING REFLECTIVE LAYER
App. No. 11/203,322
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 11/030,323
→
METHOD OF FABRICATING VERTICAL STRUCTURE LEDS
App. No. 11/002,413
→
THIN FILM LIGHT EMITTING DIODE
App. No. 10/975,095
→
METHOD OF ETCHING SUBSTRATES
App. No. 10/928,202
→
THIN FILM LED
App. No. 10/795,287
→
THIN FILM LED
App. No. 10/316,004
→
THIN FILM LIGHT EMITTING DIODE
App. No. 10/179,010
→
METHOD OF ETCHING SUBSTRATES
App. No. 10/118,318
→
METHOD OF FABRICATING VERTICAL DEVICES USING A METAL SUPPORT FILM
App. No. 10/118,317
→
METHOD OF FABRICATING OHMIC CONTACT ON N-TYPE GALLIUM NITRIDE (GAN) OF ROOM TEMPERATURE BY PLASMA SURFACE TREATMENT
App. No. 10/103,523
→
DIODE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
App. No. 09/983,994
→
METHOD OF MAKING DIODE HAVING REFLECTIVE LAYER
App. No. 09/982,980
→
DIODE HAVING HIGH BRIGHTNESS AND METHOD THEREOF
App. No. 09/905,969
→