Method for fabricating surface acoustic wave filter package
A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
1. A method of fabricating a surface acoustic wave filter chip package, said method comprising the steps of:
mounting a surface acoustic wave (SAW) filter chip on a substrate;
forming an underfill in a space between the substrate and the surface acoustic wave filter chip;
overlaying a metal shield layer on a whole outer side of the surface acoustic wave filter chip by a spraying process; and
molding a resin on the metal shield layer;
wherein said metal shield layer is formed by spraying a conductive epoxy on the outer side of the surface acoustic wave filter chip with the use of a spray nozzle.
2. The method according to claim 1 , wherein said SAW filter chip is provided with plural protector structures in order to form an air gap on a lower side surface of the surface acoustic wave filter chip.
3. The method according to claim 1 , wherein, in said molding step, an epoxy molding compound (EMC) is molded on the whole chip so as to cover said metal shield layer.
4. The method according to claim 1 , wherein said surface acoustic wave filter chip is mounted on the substrate by flip chip bonding.
5. A method of fabricating a surface acoustic wave filter chip package, said method comprising the steps of:
mounting a surface acoustic wave (SAW) filter chip on a substrate;
forming an underfill in a space between the substrate and the SAW filter chip;
overlaying a shielding layer on a whole exposed outer surface of the SAW filter chip for shielding said SAW filter chip from external electrical interference; and
molding a resin on the shielding layer;
wherein said shielding layer is formed by spraying a conductive epoxy on the exposed outer surface of the SAW filter chip with the use of a spray nozzle.
6. The method according to claim 5 , wherein said SAW filter chip is provided with plural protector structures in order to form an air gap on a lower side surface of the SAW filter chip.
7. The method according to claim 5 , wherein, in said molding step, an epoxy molding compound (EMC) is molded to cover said shielding layer.
8. The method according to claim 5 , wherein said SAW filter chip is mounted on the substrate by flip chip bonding.
9. The method according to claim 5 , wherein, in said molding step, an epoxy molding compound (EMC) is molded to completely cover said shielding layer.