Polysilicon resistor semiconductor device
View Patent ↗A semiconductor device includes a polysilicon resistor that can suppress variations in resistance value in environments with an ambient temperature higher than room temperature. The resistance value R con of a polysilicon contact is reduced to 2% or less of the sum of the resistance value R con of the polysilicon contact and the resistance value R poly of a polysilicon resistor. Hence, a semiconductor device that is not significantly affected by a variation in the resistance of the polysilicon contact is realized. This device suppresses variations in resistance value in environments with an ambient temperature higher than room temperature.
1. A semiconductor device comprising:
a semiconductor substrate;
a polysilicon resistor having two ends and formed on the semiconductor substrate via an insulating film; and
two conductors each having multiple contacts and electrically connected to the polysilicon resistor close to a respective end thereof via the respective multiple contacts,
wherein the resistance value R poly of the polysilicon resistor and the total resistance value R con of the multiple contacts of the two conductors have the following relations:
R con /( R poly +R con )≦2%.
2. A semiconductor device according to claim 1 , wherein each of the multiple contacts of the two conductors comprises a contact hole.
3. A semiconductor device according to claim 1 , wherein an integrated analog circuit is formed on the semiconductor substrate and the polysilicon resistor works as a resistance element of the analog circuit.
4. A semiconductor device according to claim 2 , wherein an integrated analog circuit is formed on the semiconductor substrate and the polysilicon resistor works as a resistance element of the analog circuit.
5. A semiconductor device according to claim 3 , wherein said analog circuit is an amplifying circuit connected to a sensor element that generates an electric signal corresponding to a detected physical amount to amplify an electric signal from the sensor element.
6. A semiconductor device according to claim 4 , wherein said analog circuit is an amplifying circuit connected to a sensor element that generates an electric signal corresponding to a detected physical amount to amplify an electric signal output from the sensor element.
7. A semiconductor device according to claim 5 , wherein said amplifying circuit is included in an integrated circuit for automobiles that is used in high-temperature environments.
8. A semiconductor device according to claim 6 , wherein said amplifying circuit is included in an integrated circuit for automobiles that is used in high-temperature.
9. A semiconductor device according to claim 5 , wherein said amplifying circuit is included in an integrated circuit for measurements that is used in high-temperature environments.
10. A semiconductor device according to claim 6 , wherein said amplifying circuit is included in an integrated circuit for measurements that is used in high-temperature environments.
11. A semiconductor device according to claim 5 , wherein said amplifying circuit is included in an integrated circuit for calibrations that is used in high-temperature environments.
12. A semiconductor device according to claim 6 , wherein said amplifying circuit is included in an integrated circuit for calibrations that is used in high-temperature environments.