IP Library › Granted Patent US 6,681,483
Granted Patent Utility
US 6,681,483 · Confirmation No. 4116

MULTI-LAYER RF PRINTED CIRCUIT ARCHITECTURE WITH LOW-INDUCTANCE INTERCONNECTION AND LOW THERMAL RESISTANCE FOR WIDE-LEAD POWER DEVICES

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 Code Description Pages PDF
2015-01-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2015-01-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2015-01-22 PA.. Power of Attorney 1 View
2015-01-22 MFEE.C.AD Maintenance Fee Address Change 2 View
2015-01-22 N417 Electronic Filing System Acknowledgment Receipt 2 View
2015-01-22 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2003-11-21 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-04-18 TRNA Transmittal of New Application 3 View
2002-04-18 A.PE Preliminary Amendment 3 View
2002-04-18 SPEC Specification 18 View
2002-04-18 CLM Claims 7 View
2002-04-18 ABST Abstract 1 View
2002-04-18 DRW Drawings-only black and white line drawings 6 View
2002-04-18 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,681,483
App. No.
10/125,221
Filed
2002-04-18
Granted
2004-01-27
Pub. No.
US20020113673A1
Art Unit
3729
PTA
-2 days