Patent Assignment
Reel/Frame 019805/0637
Assignment of Assignor's Interest
Recorded: 2007-09-10
Pages: 3
Assignee
SPECTRIAN CORPORATION
3790 VIA DE LA VALLE, SUITE 311, DEL MAR, CALIFORNIA, 92014
Covered Property
(1)
Multi-Layer Rf Printed Circuit Architecture with Low-Inductance Interconnection and Low Thermal Resistance for Wide-Lead Power Devices
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 24, 2006
From: REMEC, INC.
To: POWERWAVE TECHNOLOGIES, INC.
Reel/Frame 017823/0684 →
Patent Security Agreement
Apr 6, 2009
From: POWERWAVE TECHNOLOGIES, INC.
To: WELLS FARGO FOOTHILL, LLC, AS AGENT
Reel/Frame 022507/0027 →
Release of Security Interest
Aug 21, 2012
From: WELLS FARGO CAPITAL FINANCE, LLC, FKA WELLS FARGO FOOTHILL, LLC
To: POWERWAVE TECHNOLOGIES, INC.
Reel/Frame 028819/0014 →
Security Agreement
Sep 11, 2012
From: POWERWAVE TECHNOLOGIES, INC.
To: P-WAVE HOLDINGS, LLC
Reel/Frame 028939/0381 →
Assignment of Assignor's Interest
Nov 23, 2013
From: POWERWAVE TECHNOLOGIES, INC.
To: P-WAVE HOLDINGS, LLC
Reel/Frame 031718/0801 →
Assignment of Assignor's Interest
Feb 27, 2014
From: P-WAVE HOLDINGS, LLC
To: POWERWAVE TECHNOLOGIES S.A.R.L.
Reel/Frame 032364/0916 →
Assignment of Assignor's Interest
Nov 12, 2014
From: POWERWAVE TECHNOLOGIES S.A.R.L.
To: INTEL CORPORATION
Reel/Frame 034216/0001 →