Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
View Patent ↗A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.
1. A semiconductor device assembly, comprising:
at least one first semiconductor device;
at least one discrete conductive element protruding above an active surface of the at least one first semiconductor device;
a quantity of adhesive material on the active surface; and
at least one second semiconductor device positioned a predetermined distance over the at least one first semiconductor device and at least partially over the at least one discrete conductive element with a back side of the at least one second semiconductor device being electrically isolated from the at least one discrete conductive element the predetermined distance being defined by at least the quantity of adhesive material.
2. The semiconductor device assembly of claim 1 , wherein the at least one second semiconductor device overlies at least one of the at least one discrete conductive element and at least one bond pad of the at least one first semiconductor device.
3. The semiconductor device assembly of claim 1 , further comprising:
a substrate.
4. The semiconductor device assembly of claim 3 , wherein the substrate comprises one of a circuit board, an interposer, another semiconductor device, and leads.
5. The semiconductor device assembly of claim 3 , wherein the at least one discrete conductive element electrically connects a bond pad of the at least one first semiconductor device to a corresponding contact area of the substrate.
6. The semiconductor device assembly of claim 5 , wherein at least another discrete conductive element electrically connects a bond pad of the at least one second semiconductor device to another corresponding contact area of the substrate.
7. The semiconductor device assembly of claim 6 , further comprising:
a protective encapsulant covering at least portions of at least one of the at least one first semiconductor device, the at least one second semiconductor device, the at least one discrete conductive element, and the substrate.
8. The semiconductor device assembly of claim 7 , further comprising:
at least one external connective element.
9. The semiconductor device assembly of claim 1 , wherein the predetermined distance is further determined by at least one of a viscosity of the adhesive material, a surface tension of the adhesive material, shrinkage or expansion of the adhesive material upon curing, and a weight of the at least one second semiconductor device.
10. The semiconductor device assembly of claim 1 , wherein the at least one discrete conductive element comprises at least one of a wire bond, a tape-automated bond element, and a thermocompression bonded lead.
11. The semiconductor device assembly of claim 1 , wherein the adhesive material substantially encapsulates a portion of the at least one discrete conductive element located between the at least one first semiconductor device and the at least one second semiconductor device.
12. The semiconductor device assembly of claim 1 , wherein the at least one discrete conductive element is exposed beyond an outer periphery of the quantity of adhesive material.
13. A semiconductor device assembly, comprising:
at least two semiconductor devices in at least partially superimposed relation to one another and positioned a predetermined distance apart from one another;
at least one discrete conductive element protruding above an active surface of a first semiconductor device of the at least two semiconductor devices and located at least partially beneath and electrically isolated from a back side of a second semiconductor device of the at least two semiconductor devices;
adhesive material between at least a portion of superimposed regions of the first semiconductor device and the second semiconductor device, a quantity of the adhesive material being configured to define the predetermined distance.
14. The semiconductor device assembly of claim 13 , wherein the second semiconductor device overlies at least one of the at least one discrete conductive element and at least one bond pad of the first semiconductor device.
15. The semiconductor device assembly of claim 13 , further comprising:
a substrate.
16. The semiconductor device assembly of claim 15 , wherein the substrate comprises one of a circuit board, an interposer, another semiconductor device, and leads.
17. The semiconductor device assembly of claim 15 , wherein the at least one discrete conductive element electrically connects a bond pad of the first semiconductor device to a corresponding contact area of the substrate.
18. The semiconductor device assembly of claim 17 , wherein at least another discrete conductive element electrically connects a bond pad of the second semiconductor device to another corresponding contact area of the substrate.
19. The semiconductor device assembly of claim 18 , further comprising:
a protective encapsulant covering at least portions of at least one of the at least two semiconductor devices, the at least one discrete conductive element, and the substrate.
20. The semiconductor device assembly of claim 19 , further comprising:
at least one external connective element.
21. The semiconductor device assembly of claim 13 , wherein the predetermined distance is further determined by at least one of a viscosity of the adhesive material, a surface tension of the adhesive material, shrinkage or expansion of the adhesive material upon curing, and a weight of the second semiconductor device.
22. The semiconductor device assembly of claim 13 , wherein the at least one discrete conductive element comprises at least one of a wire bond, a tape-automated bond element, and a thermocompression bonded lead.
23. The semiconductor device assembly of claim 13 , wherein the adhesive material substantially encapsulates a portion of the at least one discrete conductive element located between the first semiconductor device and the second semiconductor device.
24. The semiconductor device assembly of claim 13 , wherein the at least one discrete conductive element is exposed beyond an outer periphery of the quantity of adhesive material.