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App. No. 10/135,487 · Confirmation No. 7554

Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2005-02-22 ABN Abandonment 2 View
2004-09-09 CTRS Requirement for Restriction/Election 5 View
2004-09-09 FWCLM Index of Claims 1 View
2002-12-13 PETDEC Petition Decision 3 View
2002-11-12 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2002-11-12 SPEC Specification 1 View
2002-11-12 CLM Claims 1 View
2002-11-12 REM Applicant Arguments/Remarks Made in an Amendment 5 View
2002-11-01 PETDEC Petition Decision 3 View
2002-10-03 PET. Petition Entered 3 View
2002-10-03 LET. Miscellaneous Incoming Letter 10 View
2002-10-03 OATH Oath or Declaration filed 1 View
2002-08-21 CTMS Miscellaneous Action with shortened statutory period (SSP) 2 View
2002-07-11 LET. Miscellaneous Incoming Letter 4 View
2002-05-30 CTMS Miscellaneous Action with shortened statutory period (SSP) 2 View
2002-04-30 TRNA Transmittal of New Application 2 View
2002-04-30 A.PE Preliminary Amendment 3 View
2002-04-30 SPEC Specification 34 View
2002-04-30 CLM Claims 5 View
2002-04-30 ABST Abstract 1 View
2002-04-30 DRW Drawings-only black and white line drawings 24 View
2002-04-30 OATH Oath or Declaration filed 2 View
2002-04-30 LET. Miscellaneous Incoming Letter 1 View
2002-04-30 WFEE Fee Worksheet (SB06) 1 View
2002-04-30 WFEE Fee Worksheet (SB06) 1 View
2002-04-30 WCLM Claims Worksheet (PTO-2022) 1 View
2002-04-30 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2002-04-30 FOR Foreign Reference 7 View
2002-04-30 FOR Foreign Reference 31 View
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Quick Facts
App. No.
10/135,487
Filed
2002-04-30
Pub. No.
US20030039845A1
Art Unit
1775