Method and system for simulating resist and etch edges

1. A method of modeling an edge profile for a layer of material, the method comprising:

generating a first model and a second model, the first model and the second model corresponding to a first elevation and a second elevation on a wafer, respectively, wherein each model includes an optical model calibrated using test measurements at the respective elevations; and

creating the edge profile using the first model and the second model,

wherein the layer comprises a composite layer, the composite layer including a first material and a second material, wherein the first model corresponds to the first material and the second model corresponds to the first material, and the method further includes:

generating a third model, wherein the third model corresponds to one of the first elevation and the second elevation on the wafer, and wherein the third model corresponds to the second material; and

creating a profile using the first, second, and third models.

2. A method of modeling an edge profile for a layer of material, the method comprising:

generating a first model and a second model, the first model and the second model corresponding to a first elevation and a second elevation on a wafer, respectively, wherein each model includes an optical model calibrated using test measurements at the respective elevations; and

creating the edge profile using the first model and the second model;

changing at least one processing setting, wherein process settings can include defocus, dose, numerical aperture, partial coherence factor, bake temperature, development time, and etch time;

generating a third model corresponding to one of the first model and the second model, the third model based on changing the at least one processing setting; and

creating another edge profile using the third model.

3. A method of modeling an edge profile for a layer of material, the method comprising:

generating a first model and a second model, the first model and the second model corresponding to a first elevation and a second elevation on a wafer, respectively, wherein each model includes an optical model calibrated using test measurements at the respective elevations; and

creating the edge profile using the first model and the second model,

wherein at least one of the first model and the second model includes multiple models based on different lithography conditions.

4. A method of identifying printing problems on a wafer, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models; and

identifying a printing problem using the profile,

wherein generating the profile includes generating a first profile of a first feature and generating a second profile of a second feature, and

wherein identifying the printing problem includes determining that at least one portion of the first profile touches the second profile, thereby indicating bridging.

5. A method of identifying printing problems on a wafer, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models; and

identifying a printing problem using the profile,

wherein generating the profile includes generating a first profile at a first location on a feature and generating a second profile at a second location on the feature, and

wherein identifying the printing problem includes comparing a first maximum height associated with the first profile with a second maximum height associated with the second profile, wherein if the first and second maximum heights are different, then feature deterioration is indicated.

6. A method of identifying printing problems on a wafer, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated usin test measurements at the redetermined elevation;

generating a profile based on at least two models; and

identifying a printing problem using the profile,

wherein identifying the printing problem includes comparing a maximum height associated with the profile with a desired height of a feature, wherein if the maximum and desired heights are different, then feature deterioration is indicated.

7. A method of identifying printing problems on a wafer, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models; and

identifying a printing problem using the profile,

wherein identifying the printing problem further includes building additional models based on different test conditions,

wherein a first test condition includes a first defocus and a second test condition includes a second defocus, and identifying the printing problem further includes looking for at least one of bridging and feature deterioration based on using the first and second defocus.

8. A system for modeling an edge profile for a layer of material, the system comprising:

means for generating a first model and a second model, the first model and the second model corresponding to a first elevation and a second elevation on a wafer, respectively, wherein each model includes an optical model calibrated using test measurements at the respective elevations; and

means for creating the edge profile using the first model and the second model, the means for creating including means for connecting the first elevation to the second elevation;

means for changing at least one processing setting, wherein process settings can include defocus, dose, numerical aperture, partial coherence factor, bake temperature, development time, and etch time;

means for generating a third model corresponding to one of the first model and the second model, the third model based on changing the at least one processing setting; and

means for creating another edge profile using the third model.

9. A method of manufacturing an integrated circuit, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models;

identifying a printing problem using the profile; and

modifying at least one condition in response to the printing problem to improve manufacturing of the integrated circuit,

wherein generating the profile includes generating a first profile of a first feature and generating a second profile of a second feature, and

wherein identifying the printing problem includes determining that at least one portion of the first profile touches the second profile, thereby indicating bridging.

10. A method of manufacturing an integrated circuit, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models;

identifying a printing problem using the profile; and

modifying at least one condition in response to the printing problem to improve manufacturing of the integrated circuit,

wherein generating the profile includes generating a first profile at a first location on a feature and generating a second profile at a second location on the feature, and

wherein identifying the printing problem includes comparing a first maximum height associated with the first profile with a second maximum height associated with the second profile, wherein if the first and second maximum heights are different, then feature deterioration is indicated.

11. A method of manufacturing an integrated circuit, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models;

identifying a printing problem using the profile; and

modifying at least one condition in response to the printing problem to improve manufacturing of the integrated circuit,

wherein identifying the printing problem includes comparing a maximum height associated with the profile with a desired height of a feature, wherein if the maximum and desired heights are different, then feature deterioration is indicated.

12. A method of manufacturing an integrated circuit, the method comprising:

building models based on test measurements, wherein each model is associated with a predetermined elevation on the wafer, and wherein each model includes an optical model calibrated using test measurements at the predetermined elevation;

generating a profile based on at least two models;

identifying a printing problem using the profile; and

modifying at least one condition in response to the printing problem to improve manufacturing of the integrated circuit,

wherein identifying the printing problem further includes building additional models based on different test conditions,

wherein a first test condition includes a first defocus and a second test condition includes a second defocus, and wherein modifying at least one condition includes selecting one of the first and second defocus for manufacturing of the integrated circuit.