IP Library Granted Patent US 7,001,874
Granted Patent B2
US 7,001,874 · App. 10/143,082 · Granted Feb 21, 2006

Non-corrosive cleaning composition for removing plasma etching residues

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Quick Facts
Patent No.
US 7,001,874
App. No.
10/143,082
Granted
Feb 21, 2006
Kind
B2
Abstract

A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary ammonium hydroxides; (d) at least one organic carboxylic acid; and (e) optionally, a polyhydric compound. The pH of the composition is preferably between about 2 to about 6.

Claims (15)

1. A cleaning composition useful for removing plasma etch residues formed on a substrate which comprises:

(a) water;

(b) at least one hydroxylammonium compound;

(c) at least one basic compound other than hydroxylamine; and

(d) at least one organic carboxylic acid consisting of carbon, hydrogen, and oxygen atoms, present in an amount between about 0.01 wt. % to 10 wt. % based on the total weight of the composition, wherein said composition is free of fluorine-containing compound.

2. The composition of claim 1 , wherein said hydroxylammonium compound is selected from the group consisting of: hydroxylammonium sulfate, hydroxylammonium nitrate, hydroxylammonium phosphate, hydroxylammonium chloride, hydroxylammonium oxalate, hydroxylammonium citrate, hydroxylammonium lactate, and mixtures thereof.

3. The composition of claim 1 , wherein said hydroxylammonium compound is present in an amount between about 0.01 wt. % to 30 wt. % based on the total weight of said composition.

4. The composition of claim 1 , wherein said basic compound is selected from the group consisting of amines and quaternary ammonium hydroxides.

5. The composition of claim 4 , wherein said basic compound is a quaternary ammonium hydroxide selected from the group consisting of: tetramethylammonium hydroxide, tetraethylammonium hydroxide, and mixtures thereof.

6. The composition of claim 1 , wherein said basic compound is present in an amount between about 0.01 wt. % to 3 wt. % based on the total weight of said composition.

7. The composition of claim 1 , wherein said organic carboxylic acid is selected from the group consisting of: lactic acid, citric acid, formic acid, oxalic acid, acetic acid, propionic acid, valeric acid, isovaleric acid, malonic acid, succinic acid, glutaric acid, maleic acid, fumaric acid, phthalic acid, 1,2,3-benzenetricarboxylic acid, glycolic acid, salicylic acid, tartaric acid, gluconic acid, and mixtures thereof.

8. The composition of claim 1 , further comprising a polyhydric compound.

9. The composition of claim 8 , wherein said polyhydric compound is selected from the group consisting of ethylene glycol, propylene glycol, glycerol, and mixtures thereof.

10. The composition of claim 1 , wherein said composition has a pH of about 2 to 6.

11. The composition of claim 1 , wherein said composition has a pH of about 3 to 4.5.

Assignments (2)
MERGER Recorded Apr 29, 2008
From: ARCH SPECIALTY CHEMICALS, INC.
To: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
Reel/Frame 020866/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2008
From: HONDA, KENJI; LEON, VINCENT; ELDERKIN, MICHELLE
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 020862/0331 →