IP Library › Assignment 020866/0493
Patent Assignment
Reel/Frame 020866/0493

Merger

Recorded: 2008-04-29 Pages: 8
Assignor
ARCH SPECIALTY CHEMICALS, INC.
Executed: 2004-11-30
Assignee
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
80 CIRCUIT DRIVE, NORTH KINGSTOWN, RHODE ISLAND, 02852
Covered Properties (39)
Use of Particular Mixtures of Ethyl Lactate and Methyl Ethyl Ketone to Remove Undesirable Peripheral Material (E.G. Edge Beads) from Photoresist-Coated Substrates
Patent: 5,151,219 →
Application: 07/386,659 →
Use of Oxalyl Chloride to Form Chloride-Doped Silicon Dioxide Films of Silicon Substrates
Patent: 5,721,176 →
Application: 07/891,484 →
Computer-Controlled Chemical Dispensing with Alternative Operating Modes
Patent: 5,551,309 →
Application: 08/374,000 →
Photoresist Stripping Composition
Patent: 5,648,324 →
Application: 08/590,005 →
Non-Corrosive Cleaning Composition for Removing Plasma Etching Residues
Patent: 5,780,406 →
Application: 08/709,053 →
Non-Corrosive Stripping and Cleaning Composition
Patent: 5,798,323 →
Application: 08/850,991 →
Aqueous Rinsing Composition
Patent: 5,977,041 →
Application: 08/936,010 →
Process for Removing Residues from a Semiconductor Subtrate
Patent: 6,033,993 →
Application: 08/936,035 →
Method for Removing Photoresist and Plasma Etch Residues
Patent: 6,245,155 →
Application: 09/055,630 →
Cleaning Composition and Method for Removing Residues
Patent: 6,030,932 →
Application: 09/081,840 →
Non-Corrosive Stripping and Cleaning Composition
Patent: 6,268,323 →
Application: 09/135,809 →
Negatively Acting Photoresist Composition Based on Polyimide Precursors
Patent: 6,010,825 →
Application: 09/151,218 →
Novel Photosensitive Polybenzoxazole Precursor Compositions
Patent: 6,143,467 →
Application: 09/404,904 →
Novel Photosensitive Resin Compositions
Patent: 6,177,225 →
Application: 09/404,905 →
Novel Photosensitive Resin Compositions
Patent: 6,127,086 →
Application: 09/406,007 →
Novel Composition for Selective Etching of Oxides Over Metals
Patent: 6,361,712 →
Application: 09/418,610 →
Non-Corrosive Cleaning Composition for Removing Plasma Etching Residues
Patent: 6,413,923 →
Application: 09/439,469 →
Publication: US 2001/0001785
Cleaning Composition and Method for Removing Residues
Patent: 6,191,086 →
Application: 09/464,485 →
Novel photosensitive resin compositions
Patent: 6,214,516 →
Application: 09/535,914 →
Novel Composition for Selective Etching of Oxides Over Metals
Patent: 6,589,439 →
Application: 09/874,081 →
Publication: US 2001/0032829
Non-corrosive stripping and cleaning composition
Patent: 6,372,050 →
Application: 09/876,635 →
Publication: US 2001/0034313
Photosensitive Polyimide Precursor Compositions
Patent: 6,511,789 →
Application: 09/886,626 →
Publication: US 2002/0025494
Automatic Refill System for Ultra Pure or Contamination Sensitive Chemicals
Patent: 6,435,224 →
Application: 09/921,452 →
Publication: US 2002/0014275
Non-Corrosive Cleaning Composition for Removing Plasma Etching Residues
Patent: 7,001,874 →
Application: 10/143,082 →
Publication: US 2002/0132745
Automatic Refill System for Ultra Pure or Contamination Sensitive Chemicals
Patent: 6,604,555 →
Application: 10/211,940 →
Publication: US 2003/0037836
Semiconductor Stress Buffer Coating Edge Bead Removal Compositions and Method for Their Use
Patent: 7,335,319 →
Application: 10/359,327 →
Publication: US 2003/0227005
Non-Corrosive Cleaning Compositions for Removing Etch Residues
Patent: 7,935,665 →
Application: 10/421,506 →
Publication: US 2003/0235996
Additives to Prevent Degradation of Alkyl-Hydrogen Siloxanes
Patent: 7,129,311 →
Application: 10/665,739 →
Publication: US 2004/0127070
Stable Non-Photosensitive Polyimide Precursor Compositions for Use in Bilayer Imaging Systems
Patent: 7,018,776 →
Application: 10/732,734 →
Publication: US 2004/0161711
Novel Photosensitive Resin Compositions
Patent: 6,939,659 →
Application: 10/793,337 →
Publication: US 2004/0229167
Novel Photosensitive Resin Compositions
Patent: 7,195,849 →
Application: 10/793,341 →
Publication: US 2004/0229160
Novel Photosensitive Resin Compositions
Patent: 6,929,891 →
Application: 10/795,577 →
Publication: US 2004/0229166
Novel Photosensitive Resin Compositions
Patent: 7,101,652 →
Application: 10/796,587 →
Publication: US 2004/0249110
Novel Photosensitive Resin Compositions
Patent: 7,129,011 →
Application: 10/860,783 →
Publication: US 2004/0253537
Novel Positive Photosensitive Resin Compositions
Patent: 7,132,205 →
Application: 10/860,784 →
Publication: US 2004/0253542
Semiconductor Stress Buffer Coating Edge Bead Removal Compositions and Method for Their Use
Application: 10/865,054 →
Publication: US 2004/0224516
Novel Photosensitive Resin Compositions
Patent: 7,416,830 →
Application: 10/966,349 →
Publication: US 2005/0181297
Novel Photosensitive Resin Compositions
Patent: 7,056,641 →
Application: 11/177,044 →
Publication: US 2005/0271980
Additives to Prevent Degradation of Alkyl-Hydrogen Siloxanes
Patent: 7,531,590 →
Application: 11/496,135 →
Publication: US 2006/0270787
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Effective Date: Dec. 12, 1990 Mar 14, 1991
From: OLIN HUNT SPECIALTY PRODUCTS INC.
To: OCG MICROELECTRONIC MATERIALS, INC.
Reel/Frame 005630/0516 →
Assignment of Assignors Interest. May 29, 1992
From: MC GEARY, MICHAEL J.; BOEGLIN, HERMAN J.
To: OLIN CORPORATION A CORP. OF VIRGINIA
Reel/Frame 006141/0809 →
Assignment of Assignor's Interest Jan 17, 1995
From: GOOSSENS, DIRK; BOEGLIN, HERMAN J.
To: OLIN CORPORATION
Reel/Frame 007315/0049 →
Assignment of Assignor's Interest Jan 23, 1996
From: HONDA, KENJI; PERRY, DONALD F.; MAW, TAISHIH
To: OCG MICROELECTRONIC MATERIALS, INC.
Reel/Frame 007862/0943 →
Assignment of Assignor's Interest Sep 10, 1996
From: HONDA, KENJI; ROTHGERY, EUGENE F.
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008216/0244 →
Change of Name Apr 18, 1997
From: OCG MICROELECTRONIC MATERIALS, INC.
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008495/0994 →
Assignment of Assignor's Interest May 5, 1997
From: HONDA, KENJI; MOLIN, RICHARD M.; HANSEN, GALE L.
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008534/0527 →
Assignment of Assignor's Interest Sep 23, 1997
From: HONDA, KENJI
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008727/0896 →
Assignment of Assignor's Interest Sep 23, 1997
From: HONDA, KENJI
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008730/0511 →
Assignment of Assignor's Interest Nov 21, 1997
From: LOVE, M. LEE, JR.
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008809/0951 →
Assignment of Assignor's Interest Jul 2, 1998
From: LEON, VINCENT G.; HONDA, KENJI; ROTHGERY, EUGENE F.
To: OLIN MICROELECTRONIC CHEMICALS
Reel/Frame 009287/0795 →
Assignment of Assignor's Interest Aug 18, 1998
From: HONDA, KENJI
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 009398/0452 →
Assignment of Assignor's Interest Oct 19, 1998
From: HAGEN, SIGURD; REICHLIN, NADIA
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 009593/0721 →
Assignment of Assignor's Interest Jun 1, 1999
From: MOLIN, RICHARD MARK; HANSEN, GALE LYNNE
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 009992/0139 →
Assignment of Assignor's Interest Jun 1, 1999
From: HONDA, KENJI
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 009991/0545 →
Assignment of Assignor's Interest Aug 1, 1999
From: LEON, VINCENT G.; HONDA, KENJI; ROTHGERY, EUGENE F.
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 010156/0228 →
Change of Name Aug 10, 1999
From: OLIN MICROELECTRONIC CHEMICALS, INC.
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010156/0810 →
Assignment of Assignor's Interest Nov 26, 1999
From: HSU, STEVE LIEN-CHUNG
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010400/0495 →
Assignment of Assignor's Interest Nov 26, 1999
From: WATERSON, PAMELA J; NAIINI, AHMAD; WEBER, WILLIAM D.
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010400/0477 →
Assignment of Assignor's Interest Dec 1, 1999
From: HONDA, KENJI; ELDERKIN, MICHELLE
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010407/0928 →
Assignment of Assignor's Interest Dec 13, 1999
From: HSU, STEVE LIEN-CHUNG
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010435/0735 →
Assignment of Assignor's Interest Dec 13, 1999
From: WEBER, WILLIAM D.; WATERSON, PAMELA J.; NAIINI, AHMAD
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010429/0973 →
Assignment of Assignor's Interest Dec 13, 1999
From: HSU, STEVE LIEN-CHUNG
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010430/0681 →
Assignment of Assignor's Interest Dec 13, 1999
From: WATERSON, PAMELA J.; NAIINI, AHMAD; WEBER, WILLIAM D.; MALIK, SANJAY
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 010430/0902 →
Change of Name Jan 10, 2000
From: OLIN MICROELECTRIC CHEMICALS, INC.
To: ARCH SPECIALTY CHEMICAL, INC.
Reel/Frame 010522/0798 →