IP Library Granted Patent US 7,335,319
Granted Patent B2
US 7,335,319 · App. 10/359,327 · Granted Feb 26, 2008

Semiconductor stress buffer coating edge bead removal compositions and method for their use

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Quick Facts
Patent No.
US 7,335,319
App. No.
10/359,327
Granted
Feb 26, 2008
Kind
B2
Abstract

An edge bead remover composition that includes at least one ketone selected from the group consisting of: wherein R 1 and R 2 are independently selected from the group consisting of: methyl, ethyl, n-propyl, n-butyl, sec-butyl, and isobutyl, and wherein n equals 1 or 2; at least one ester other than lactones; and at least one lactone.

Claims (7)

1. An edge bead remover composition comprising:

at least one ketone selected from the group consisting of:

wherein R 1 and R 2 are independently selected from the group consisting of:

methyl, ethyl, n-propyl, and combinations thereof, wherein n equals 1 or 2, and wherein said ketone of said Formula 1 has a total of 4 to 5 carbon atoms;

at least one ester other than lactones; and

at least one lactone;

wherein said at least one ketone is 2-pentanone, present in an amount between 35 wt. % to 50 wt. %; said at least one ester is ethyl lactate, present in an amount between 35 wt. % to 50 wt. %; and said at least one lactone is gamma-butyrolactone, present in an amount between 20 wt. % to 30 wt. %.

Assignments (2)
MERGER Recorded Apr 29, 2008
From: ARCH SPECIALTY CHEMICALS, INC.
To: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
Reel/Frame 020866/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2003
From: PETERSON, LAURIE J.; HOPLA, RICHARD E.; NAIINI, AHMAD A.; WEBER, WILLIAM D.; WATERSON, PAMELA J.
To: ARCH SPECIALTY CHEMICALS, INC.
Reel/Frame 014127/0619 →