IP Library › Assignment 008495/0994
Patent Assignment
Reel/Frame 008495/0994

Change of Name

Recorded: 1997-04-18 Pages: 6
Assignor
Assignee
OLIN MICROELECTRONIC CHEMICALS, INC.
P.O. BOX 4500, 501 MERRITT 7, NORWALK, CONNECTICUT, 06856
Covered Properties (107)
Positive Novolak Photoresist Compositions
Patent: 4,377,631 →
Application: 06/275,883 →
Positive Photoresist Composition with Cresol-Formaldehyde Novolak Resins
Patent: 4,529,682 →
Application: 06/403,935 →
Non-Glass Chemical Container
Patent: 284,035 →
Application: 06/497,262 →
Photosensitive Polymers as Coating Materials
Patent: 4,657,832 →
Application: 06/608,754 →
Polyimides, a Process for Their Preparation and Their Use
Patent: 4,629,777 →
Application: 06/608,755 →
Positive Photoresist with Cresol-Formaldehyde Novolak Resin and Photosensitive Naphthoquinone Diazide
Patent: 4,587,196 →
Application: 06/666,743 →
A Process for Irradiating Polyimidies
Patent: 4,629,685 →
Application: 06/795,591 →
Polyimides, a Process for Their Preparation and Their Use, and Tetracarboxylic Acids and Tetracarboxylic Acid Derivatives
Patent: 4,698,295 →
Application: 06/796,380 →
Polyamide Ester Photoresist Formulations of Enhanced Sensitivity
Patent: 4,701,300 →
Application: 06/818,950 →
Cyclic Acetals or Ketals of Beta-Keto Esters or Amides
Patent: 4,737,426 →
Application: 06/859,683 →
Polyimides and a Process for Their Preparation
Patent: 4,677,186 →
Application: 06/895,603 →
Development of Positive-Working Photoresist Compositions
Patent: 4,711,836 →
Application: 06/895,628 →
Novel Organometallic Polymers
Patent: 4,734,481 →
Application: 07/001,312 →
Light-Sensitive 1,2-Naphthoquinone-2-Diazide-4- Sulfonic Acid Monoesters of Cycloalkyl Sustituted Phenol and Their Use in Light- Sensitive Mixtures
Patent: 4,797,345 →
Application: 07/068,397 →
Polyimides, a Process for Their Preparation and Their Use, and Tetracarboxylic Acids and Tetracarboxylic Acid Derivatives
Patent: 4,914,182 →
Application: 07/070,749 →
Polyimides, a Process for Their Preparation and Their Use, and Tetracarboxylic Acids and Tetracarboxylic Acid Derivatives
Patent: 4,914,181 →
Application: 07/070,750 →
Photoresist Compositions Containing Selected 6-Acetoxy Cyclohexadienone Photosensitizers and Novolak Resins
Patent: 4,902,603 →
Application: 07/104,697 →
Amino-Tetraalkylbenzoylphthalic Acids
Patent: 4,808,732 →
Application: 07/115,544 →
Cyclic Acetals or Ketals of 8-Keto Esters or Amides
Patent: 4,806,448 →
Application: 07/125,668 →
Use of Particular Mixtures of Ethyl Lactate and Methyl Ethyl Ketone to Remove Undesirable Peripheral Material (E.G. Edge Beads) from Photoresist-Coated Substrates
Patent: 4,886,728 →
Application: 07/141,128 →
Light-Sensitive O-Quinone Diazide Composition and Product with Phenolic Novolak Prepared by Condensation with Haloacetoaldehyde
Patent: 4,959,292 →
Application: 07/217,512 →
Positive-Working Photoresists Employing a Selected Mixture of Ethyl Lactate and Ethyl 3-Ethoxy Propionate as Casting Solvent
Patent: 4,965,167 →
Application: 07/269,521 →
Auto-Photocrosslinkable Copolyimides and Polyimide Compositions
Patent: 4,925,912 →
Application: 07/281,429 →
Selected Trinuclear Novolak Oligomers and Their Use in Photoactive Compounds and Radiation Sensitive Mixtures
Patent: 4,957,846 →
Application: 07/290,009 →
Process for the Preparation of 1,2-Disulfone Compounds
Patent: 4,980,508 →
Application: 07/308,483 →
Thermally Stable Phenolic Resin Compositions with Ortho, Ortho Methylene Linkage
Patent: 4,970,287 →
Application: 07/325,399 →
Process for Coating a Photoresist Composition Onto a Substrate
Patent: 4,996,080 →
Application: 07/333,519 →
Use of Particular Mixtures of Ethyl Lactate and Methyl Ethyl Ketone to Remove Undesirable Peripheral Material (E.G. Edge Beads) from Photoresist-Coated Substrates
Patent: 5,151,219 →
Application: 07/386,659 →
Process for Developing Selected Positive Photoresists
Patent: 5,069,996 →
Application: 07/408,849 →
Tris-(Hydroxyphenyl) Lower Alkane Compounds as Sensitivity Enhancers for O-Quinonediazide Containing Radiation - Sensitive Compositions and Elements
Patent: 5,215,856 →
Application: 07/409,221 →
Positive Photoresist Composition Containing Radiation Sensitive Quinonediazide Compound and Completely Esterified Polyamic Acid Polymer
Patent: 5,104,768 →
Application: 07/430,760 →
Disubstituted Aromatic Dianhydrides
Patent: 5,077,415 →
Application: 07/467,622 →
Auto-Photocrosslinkable Copolyimides and Polyimide Compositions
Patent: 5,102,959 →
Application: 07/487,563 →
Positive-Working Photoresist Process Employing a Selected Mixture of Ethyl Lactate and Ethyl 3-Ethoxy Propionate as Casting Solvent During Photoresist Coating
Patent: 5,063,138 →
Application: 07/533,258 →
Selected Trinuclear Novolak Oligomers and Their Use in Photoactive Compounds and Radiation Sensitive Mixtures
Patent: 4,992,596 →
Application: 07/534,908 →
Process of Developing a Radiation Imaged Product with Trinuclear Novolak Oligomer Having O-Naphthoquinone Diazide Sulfonyl Group
Patent: 4,992,356 →
Application: 07/534,909 →
Thermally Stable Phenolic Resin Compositions and Their Use in Light- Sensitive Compositions
Patent: 5,053,479 →
Application: 07/540,054 →
Process of Forming Resist Image in Positive Photoresist with Thermally Stable Phenolic Resin
Patent: 5,001,040 →
Application: 07/540,249 →
Positive Photoresist Composition
Patent: 5,145,763 →
Application: 07/545,702 →
Thermally Stable Light-Sensitive Composition with O-Quinone Diazide and Phenolic Resin Used in a Method of Forming a Positive Photoresist Image
Patent: 5,024,921 →
Application: 07/552,394 →
Process for Selective Removal of Dimeric Species from Phenolic Polymers
Patent: 5,132,376 →
Application: 07/630,673 →
Desensitized Quinone Diazide Compounds Utilizing Microcrystalline Cellulose as Desensitizing Agent
Patent: 5,075,193 →
Application: 07/662,395 →
Positive Diazo Quinone Photoresist Compositions Containing Antihalation Compound
Patent: 5,334,481 →
Application: 07/692,811 →
Photoresist Composition Containing Diazoquinone Photosensitizer and Novolak Resin Characterized by the Complete and Selective Removal of Dimeric Species from the Novolak Resin
Patent: 5,151,339 →
Application: 07/702,155 →
Selected Block Phenolic Oligomers and Their Use in Radiation-Sensitive Resist Compositions
Patent: 5,196,289 →
Application: 07/711,350 →
Selected Block Copolymer Novolak Binder Resins and Raiation-Sensitive Resist Compositions
Patent: 5,188,921 →
Application: 07/711,351 →
Radiation-Sensitive Compositions Containing Fully Substituted Novolak Polymers
Patent: 5,237,037 →
Application: 07/713,891 →
Benzoates Containing a Substituent Having Olefinic Unsaturation
Patent: 5,106,932 →
Application: 07/731,188 →
Method for Removing Metal Impurities from Resist Components
Patent: 5,446,125 →
Application: 07/753,488 →
Method for Removing Impurities from Resist Components and Novolak Resins
Patent: 5,378,802 →
Application: 07/753,526 →
Method for Removing Metal Impurities from Resist Components
Patent: 5,446,126 →
Application: 07/753,533 →
Radiation-Sensitive Compositions Using Novolak Resins Made from a Substituted Bis(Hydroxy Phenyl) Methane and a Bis(Methylol) - Cresol
Patent: 5,306,594 →
Application: 07/787,454 →
Photoresist Developer Containing Fluorinated Amphoteric Surfactant
Patent: 5,164,286 →
Application: 07/825,240 →
Benzoates Containing a Substituent Having Olefinic Unsaturation
Patent: 5,166,405 →
Application: 07/831,119 →
Copolymers Crosslinkable by Acid Catalysis
Patent: 5,274,060 →
Application: 07/843,798 →
Photosensitive Compositions Based on Polyphenols and Acetals
Patent: 5,238,781 →
Application: 07/843,799 →
Chemically Modified Hydroxy Styrene Polymer Resins and Their Use in Photoactive Resist Compositions Wherein the Modifying Agent Is Monomethylol Phenol
Patent: 5,340,687 →
Application: 07/879,021 →
Positive-Working Radiation Sensitive Mixtures and Articles Containing Alkali-Soluble Binder, O-Quinonediazide Photoactive Compound and Blankophor Fbw Actinic Dye
Patent: 5,275,909 →
Application: 07/891,011 →
Selected Chelate Resins and Their Use to Remove Multivalent Metal Impurities from Resist Components
Patent: 5,300,628 →
Application: 07/906,183 →
Positive Photoresists Containing Quinone Diazide Photosensitizer, Alkali-Soluble Resin and Tetra(Hydroxyphenyl) Alkane Additive
Patent: 5,296,330 →
Application: 07/932,128 →
Radiation-Sensitive Compositions
Patent: 5,356,740 →
Application: 07/979,498 →
Selected Block Phenolic Oligomers and Their Use in Phenolic Resin Compositions and in Radiation-Sensitive Resist Compositions
Patent: 5,302,688 →
Application: 07/984,700 →
Novolak Resins and Their Use in Radiation-Sensitive Compositions Wherein the Novolak Resins Are Made by Condensing 2,6-Dimethylphenol, 2,3-Dimethylphenol, a Para-Substituted Phenol and an Aldehyde
Patent: 5,346,799 →
Application: 07/986,223 →
Sesamol/Aldehyde Condensation Products as Sensitivity Enhancers for Radiation Sensitive Mixtures
Patent: 5,275,911 →
Application: 08/011,565 →
Process of Developing a Positive Pattern in an O-Quinone Diazide Photoresist Containing a Tris-(Hydroxyphenyl) Lower Alkane Compound Sensitivity Enhancer
Patent: 5,256,521 →
Application: 08/011,572 →
Selected Novolak Resin Planarization Layer for Lithographic Applications
Patent: 5,276,126 →
Application: 08/015,055 →
Positive Photoresists Comprising a Novolak Resin Made from 2,3- Dimethyl Phenol, 2,3,5-Trimethyl Phenol and Aldehyde with No Meta- Cresol Present
Patent: 5,322,757 →
Application: 08/037,488 →
Phenylacetates and the Use Thereof
Patent: 5,380,882 →
Application: 08/040,230 →
O-Naphthoquinone Diazide Sulfonyl Esters of 4-(4-Hydroxyphenyl) Cyclohexanone Phenolic Derivatives with Associated Radiation Sen- Sitive Mixtures and Articles
Patent: 5,278,021 →
Application: 08/045,022 →
Selected Phenolic Derivatives of 4-(4-Hydroxyphenyl)-Cyclohexanone and Their Use as Sensitivity Enhancers for Radiation Sensitive Mixtures
Patent: 5,283,374 →
Application: 08/045,024 →
Photoresist Material Based on Polystryenes
Patent: 5,324,804 →
Application: 08/051,720 →
High Ortho-Ortho Bonded Novolak Binder Resins and Their Use in Radiation-Sensitive Compositions
Patent: 5,413,894 →
Application: 08/057,999 →
Radiation-Sensitive Compositions Containing NOV0LAK Polymers Made from Four Phenolic Derivatives and an Aldehyde
Patent: 5,324,620 →
Application: 08/097,426 →
Process of Developing an Image Utilizing Positive-Working Radiation Sensitive Mixtures Containing Alkali-Soluble Binder, O-Quinonediazide Photoactive Compound and Blankophor Fbw Actinic Dye
Patent: 5,284,737 →
Application: 08/108,266 →
Radiation-Sensitive Compositions Containing 5-Indanol in the Binder Resin as a Comonomer
Patent: 5,316,884 →
Application: 08/122,953 →
Positive Image Formation Utilizing Radiation Sensitive Mixture Containing Dimeric or Trimeric Sesamol/Aldehyde Condensation Products as Sensitivity Enhancers
Patent: 5,328,806 →
Application: 08/134,448 →
Process of Developing a Positive Image Utilizing O-Naphthoquinone Diazide Radiation-Sensitive Esters of Phenolic Derivatives of 4-(4- Hydroxyphenyl)Cyclohexanone
Patent: 5,312,720 →
Application: 08/137,522 →
Positive Image Formation Utilizing O-Quinonediazide Composition Including Selected Phenolic Derivatives of 4-(4-Hydroxyphenyl)- Cyclohexanone
Patent: 5,346,808 →
Application: 08/148,235 →
Positive Photoresist Having Improved Processing Properties
Patent: 5,369,200 →
Application: 08/160,818 →
Positive Photoresists with Enhanced Resolution and Reduced Crystallisation Containing Novel Tetra(Hydroxyphenyl)Alkanes
Patent: 5,436,098 →
Application: 08/180,180 →
Phenolic Novolak Resin Compositions Containing 5-Indanol and Their Use a Process for Forming Positive Resist Patterns
Patent: 5,338,653 →
Application: 08/194,193 →
Selected Structurally Defined Novolak Binder Resins and Their Use in Radiation-Sensitive Compositions
Patent: 5,350,827 →
Application: 08/194,292 →
Selected Structurally Defined Novolak Binder Resins and Their Use in Photoresist Pattern Formation
Patent: 5,338,652 →
Application: 08/194,293 →
A Process of Photopatterning a Substrate with a Positive Photoresist Composition Containing a Diazoquinone Photosensitizer
Patent: 5,399,463 →
Application: 08/227,831 →
Non-Corrosion Photoresist Stripping Composition
Patent: 5,472,830 →
Application: 08/228,775 →
Coated Substrate Utilizing Composition Including Selected Phenolic Derivatives of 4-(4-Hydroxyphenyl)-Cyclohexanone as Sensitivity Enhancers
Patent: 5,366,843 →
Application: 08/236,605 →
Positive Photoresist Having Improved Processing Properties
Patent: 5,397,680 →
Application: 08/249,972 →
Chemically Amplified Radiation-Sensitive Composition
Patent: 5,550,004 →
Application: 08/292,899 →
Phenylacetates and Their Use in Radiation Sensitive Compositions
Patent: 5,476,751 →
Application: 08/323,482 →
Environmentally Safe Dispensing Assembly for Ultra-Pure Liquid Chemicals
Patent: 5,462,207 →
Application: 08/325,020 →
Photoresist Compositions Containing Copolymers Having Acid-Labile Groups and Recurring Units Derived from Either N-(Hydroxymethyl)Maleimide or N-(Acetoxymethyl)Maleimide or Both
Patent: 5,558,978 →
Application: 08/358,131 →
High Ortho-Ortho Bonded Novolak Binder Resins and Their Use in a Process for Forming Positive Resist Patterns
Patent: 5,494,785 →
Application: 08/373,685 →
High Ortho-Ortho Bonded Novolak Binder Resins and Their Use in Radiation-Sensitive Compositions
Patent: 5,473,045 →
Application: 08/373,705 →
Selected O-Quinonediazide Sulfonic Acid Esters of Phenolic Compounds and Their Use in Radiation-Sensitive Compositions
Patent: 5,541,033 →
Application: 08/384,501 →
Tetra(Hydroxphenyl)Alkanes
Patent: 5,554,797 →
Application: 08/399,686 →
Non-Corrosive Photoresist Stripper Composition
Patent: 5,545,353 →
Application: 08/436,548 →
Novolak Containing Photoresist Stripper Composition
Patent: 5,507,978 →
Application: 08/436,549 →
Chelating Reagent Containing Photoresist Stripper Composition
Patent: 5,561,105 →
Application: 08/436,550 →
O-Quinonediazide Sulfonic Acid Esters of Phenolic Compounds and Their Use in Forming Positive Images
Patent: 5,547,814 →
Application: 08/451,599 →
Selected O-Quinonediazide Sulfonic Acid Esters of Phenolic Compounds and Their Use in Radiation-Sensitive Compositions
Patent: 5,602,260 →
Application: 08/451,939 →
Chemically Amplified Radiation-Sensitive Composition Used in a Process for Fabricating a Semiconductor Device
Patent: 5,565,304 →
Application: 08/463,251 →
Crosslinked Polymers
Patent: 5,714,559 →
Application: 08/572,343 →
Process for the Preparation of Partially Protected Phenolic Resins
Patent: 5,663,038 →
Application: 08/572,344 →
Photoresist Stripping Composition
Patent: 5,648,324 →
Application: 08/590,005 →
Photoresist Stripping Composition
Patent: 5,665,688 →
Application: 08/590,010 →
Wet-Chemical Developable, Etch-Stable Photoresist for Uv Radiation with a Wavelength Below 200 Nm
Patent: 5,776,657 →
Application: 08/614,613 →
Cross-Linked Polymers
Patent: 5,849,808 →
Application: 08/635,085 →
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jun 22, 1981
From: TOUKHY, MEDHAT A.; KLAWANSKY, LEO
To: PHILIP A HUNT CHEMICAL CORPORATION
Reel/Frame 003896/0915 →
Assignment of Assignors Interest. Nov 18, 1983
From: DE LEEUWE, MARC; BEITEL, JEFFREY S.
To: UNION CARBIDE CORPORATION, A CORP OF NY
Reel/Frame 004191/0640 →
Assignment of Assignors Interest. Jan 14, 1985
From: TOUKHY, MEDHAT A.
To: PHILIP A. HUNT CHEMCAL CORPORATION
Reel/Frame 004349/0632 →
Assignment of Assignors Interest. Jan 14, 1985
From: TOUKHY, MEDHAT A.
To: PHILIP A. HUNT CHEMICAL CORPORATION
Reel/Frame 004349/0054 →
Mortgage Jan 9, 1986
From: UNION CARBIDE CORPORATION, A CORP.,; STP CORPORATION, A CORP. OF DE.,; UNION CARBIDE AGRICULTURAL PRODUCTS CO., INC., A CORP. OF PA.,; UNION CARBIDE EUROPE S.A., A SWISS CORP.
To: MORGAN GUARANTY TRUST COMPANY OF NEW YORK, AND MORGAN BANK ( DELAWARE ) AS COLLATERAL ( AGENTS ) SEE RECORD FOR THE REMAINING ASSIGNEES.
Reel/Frame 004547/0001 →
Assignment of Assignors Interest. Aug 11, 1986
From: CIBA-GEIGY AG, A SWISS COMPANY
To: CIBA-GEIGY CORPORATION, A CORP OF NY.
Reel/Frame 004590/0154 →
Assignment of Assignors Interest. Oct 5, 1987
From: SLATER, SYDNEY G.; FICNER, STANLEY
To: OLIN CORPORATION, A CORP. OF
Reel/Frame 004794/0223 →
Assignment of Assignors Interest. Dec 10, 1987
From: CIBA-GEIGY AG
To: CIBA-GEIGY CORPORATION, 444 SAW MILL RIVER ROAD, ARDSLEY, NEW YORK 10502, A NY CORP.
Reel/Frame 004797/0456 →
Assignment of Assignors Interest. Jan 6, 1988
From: SALAMY, THOMAS E.; LOVE, MARVIN L. JR.; TOWNER, MARK E.
To: OLIN HUNT SPECIALTY PRODUCTS INC., A CORP. OF DE
Reel/Frame 004820/0795 →
Assignment of Assignors Interest. Jul 11, 1988
From: BLAKENEY, ANDREW J.; SARUBBI, THOMAS; SIZENSKY, JOSEPH J.
To: OLIN HUNT SPECIALITY PRODUCTS, INC.
Reel/Frame 004907/0513 →
Assignment of Assignors Interest. Nov 10, 1988
From: SALAMY, THOMAS E.
To: OLIN HUNT SPECIALTY PRODUCTS INC., A CORP. OF DE
Reel/Frame 004995/0450 →
Assignment of Assignors Interest. Dec 27, 1988
From: JEFFRIES, ALFRED T. III; BLAKENEY, ANDREW J.; TOUKHY, MEDHAT A.
To: OLIN HUNT SPECIALTY PRODUCTS INC., A CORP. OF DE.
Reel/Frame 005011/0410 →
Assignment of Assignors Interest. Feb 10, 1989
From: BARTMANN, EKKEHARD
To: MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG
Reel/Frame 005040/0831 →
Assignment of Assignors Interest. Apr 18, 1989
From: MERCK PATENT GMBH
To: CIBA-GEIGY CORPORATION
Reel/Frame 005048/0308 →
Assignment of Assignors Interest. Mar 6, 1990
From: ROHDE, OTTMAR; JASNE, STANLEY J.; PFEIFER, JOSEF
To: CIBA-GEIGY CORPORATION
Reel/Frame 005243/0372 →
Change of Name Sep 17, 1990
From: PHILIP A. HUNT CHEMICAL CORPORATION
To: OLIN HUNT SPECIALTY PRODUCTS INC.
Reel/Frame 005435/0649 →
Change of Name Effective Date: Dec. 12, 1990 Mar 14, 1991
From: OLIN HUNT SPECIALTY PRODUCTS INC.
To: OCG MICROELECTRONIC MATERIALS, INC.
Reel/Frame 005630/0516 →
Assignment of Assignors Interest. Mar 10, 1992
From: MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG
To: CIBA-GEIGY CORPORATION
Reel/Frame 006331/0025 →
Assignment of Assignors Interest. Mar 23, 1992
From: UNION CARBIDE CHEMICALS AND PLASTICS COMPANY INC. A CORP. OF NEW YORK
To: OCG MICROELECTRONIC MATERIALS, INC. A CORP. OF DELAWARE
Reel/Frame 006050/0225 →
Assignment of Assignor's Interest Aug 11, 1994
From: OLIN CORPORATION
To: OCG MICROELECTRONIC MATERIALS, INC.
Reel/Frame 007097/0255 →
Assignment of Assignor's Interest Feb 20, 1996
From: CIBA-GEIGY CORPORATION
To: OCG MICROELECTRONIC MATERIALS, INC.
Reel/Frame 007815/0833 →