Patent Assignment
Reel/Frame 007815/0833
Assignment of Assignor's Interest
Recorded: 1996-02-20
Pages: 8
Assignor
CIBA-GEIGY CORPORATION
Executed: 1995-08-23
Assignee
OCG MICROELECTRONIC MATERIALS, INC.
P. O. BOX 4500, 501 MERRITT 7, NORWALK, CONNECTICUT, 06856
Covered Properties
(56)
Process for the Development of Relief Structures Based on Radiation- Crosslinked Polymeric Precursors of Polymers Which Are Resistant to High Temperature
Patent:
4,539,288 →
Application:
06/561,505 →
Photosensitive Polymers as Coating Materials
Patent:
4,657,832 →
Application:
06/608,754 →
Polyimides, a Process for Their Preparation and Their Use
Patent:
4,629,777 →
Application:
06/608,755 →
Homopolymers, Copolymers and Coated Material and Its Use
Patent:
4,680,195 →
Application:
06/732,334 →
A Process for Irradiating Polyimidies
Patent:
4,629,685 →
Application:
06/795,591 →
Polyimides, a Process for Their Preparation and Their Use, and Tetracarboxylic Acids and Tetracarboxylic Acid Derivatives
Patent:
4,698,295 →
Application:
06/796,380 →
Polyamide Ester Photoresist Formulations of Enhanced Sensitivity
Patent:
4,701,300 →
Application:
06/818,950 →
Stabilized Solutions of Radiation-Crosslinkable Polymer Precursors of Highly Heat-Resistant Polymers
Patent:
4,757,098 →
Application:
06/853,102 →
Negatively Operating Photoresist Composition, with Radiation-Absorbing Additives
Patent:
4,762,767 →
Application:
06/857,663 →
Cyclic Acetals or Ketals of Beta-Keto Esters or Amides
Patent:
4,737,426 →
Application:
06/859,683 →
Polyimides and a Process for Their Preparation
Patent:
4,677,186 →
Application:
06/895,603 →
Adhesively Bonded Photostructurable Polyimide Film
Patent:
4,786,569 →
Application:
06/901,095 →
Substituted O-Phthalaldehydes
Patent:
4,820,829 →
Application:
07/001,309 →
Novel Organometallic Polymers
Patent:
4,734,481 →
Application:
07/001,312 →
Homopolymers, Copolymers and Coated Material and Its Use
Patent:
4,783,372 →
Application:
07/041,889 →
Diamino-9,10-Dihydroanthracenes and Polyamide Acid (Esters) and Polyimides Derived Therefrom
Patent:
4,847,359 →
Application:
07/063,881 →
Radiation-Sensitive Polycondensates, Processes for Their Preparation, Coated Material and Its Use
Patent:
4,785,074 →
Application:
07/064,728 →
Material Coated with Polyamic Acid Ester
Patent:
4,814,233 →
Application:
07/067,589 →
Polyimides, a Process for Their Preparation and Their Use, and Tetracarboxylic Acids and Tetracarboxylic Acid Derivatives
Patent:
4,914,182 →
Application:
07/070,749 →
Polyimides, a Process for Their Preparation and Their Use, and Tetracarboxylic Acids and Tetracarboxylic Acid Derivatives
Patent:
4,914,181 →
Application:
07/070,750 →
Radiation-Sensitive Polycondensates, Their Preparation, Material Coated Therewith and the Use Thereof
Patent:
4,764,584 →
Application:
07/099,373 →
Positive O - Quinone Diazide Photoresist Composition with a Bis - Benzotriazole
Patent:
4,871,644 →
Application:
07/099,880 →
1,2-Naphthoquinone Diazide Sulfonyl Ester Compound with Linking Benzotriazole Groups and Light-Sensitive Composition with Compound
Patent:
4,835,085 →
Application:
07/105,379 →
Amino-Tetraalkylbenzoylphthalic Acids
Patent:
4,808,732 →
Application:
07/115,544 →
Cyclic Acetals or Ketals of 8-Keto Esters or Amides
Patent:
4,806,448 →
Application:
07/125,668 →
Photostructurable Polyimide Mixtures
Patent:
4,851,506 →
Application:
07/135,813 →
Adhesively Bonded Photostructurable Polyimide Film
Patent:
4,935,320 →
Application:
07/231,323 →
Auto-Photocrosslinkable Copolyimides and Polyimide Compositions
Patent:
4,925,912 →
Application:
07/281,429 →
Process for the Preparation of 1,2-Disulfone Compounds
Patent:
4,980,508 →
Application:
07/308,483 →
Positive Photoresist Composition Containing Radiation Sensitive Quinonediazide Compound and Completely Esterified Polyamic Acid Polymer
Patent:
5,104,768 →
Application:
07/430,760 →
Disubstituted Aromatic Dianhydrides
Patent:
5,077,415 →
Application:
07/467,622 →
Polyimides Prepared from Disubstituted Aromatic Tetracarboxylic Acid Dianhydrides
Patent:
5,153,303 →
Application:
07/467,710 →
Auto-Photocrosslinkable Copolyimides and Polyimide Compositions
Patent:
5,102,959 →
Application:
07/487,563 →
Positive Photoresist Composition Containing Alkali-Soluble Phenolic Resin, Photosensitive Quinonediazide Compound and Sulfonyl Containing Compound
Patent:
5,106,718 →
Application:
07/648,954 →
Positive Photoresist Containing 2,3,4-Trihydroxybenzophenone and 1,2-Naphthoquinone-Diazide-5-Sulfonyl Trisester of 1,3,5-Trihydroxy- Benzene
Patent:
5,077,173 →
Application:
07/649,271 →
Desensitized Quinone Diazide Compounds Utilizing Microcrystalline Cellulose as Desensitizing Agent
Patent:
5,075,193 →
Application:
07/662,395 →
Positive Diazo Quinone Photoresist Compositions Containing Antihalation Compound
Patent:
5,334,481 →
Application:
07/692,811 →
Benzoates Containing a Substituent Having Olefinic Unsaturation
Patent:
5,106,932 →
Application:
07/731,188 →
Acid Labile Dissolution Inhibitors and Positive- and Negative-Acting Photosensitive Composition Based Thereon
Patent:
5,210,003 →
Application:
07/756,631 →
Positive Photoresist Containing 1,2-Naphthoquinone-Diazide-5-Sulfonyl Tris Ester of 1,3,5-Trihydroxybenzene and Aromatic Hydroxy Compound Sensitizer
Patent:
5,219,701 →
Application:
07/771,088 →
Photoresist Composition Containing Specific Amounts of a Naphtho- Quinone Diazide Sulfonyl Ester of Tetrahydroxy Diphenyl Sulfide and a Polyhydroxy Compound
Patent:
5,200,293 →
Application:
07/793,494 →
Benzoates Containing a Substituent Having Olefinic Unsaturation
Patent:
5,166,405 →
Application:
07/831,119 →
Copolymers Crosslinkable by Acid Catalysis
Patent:
5,274,060 →
Application:
07/843,798 →
Photosensitive Compositions Based on Polyphenols and Acetals
Patent:
5,238,781 →
Application:
07/843,799 →
Positive Photoresists Containing Quinone Diazide Photosensitizer, Alkali-Soluble Resin and Tetra(Hydroxyphenyl) Alkane Additive
Patent:
5,296,330 →
Application:
07/932,128 →
Radiation-Sensitive Compositions
Patent:
5,356,740 →
Application:
07/979,498 →
Acid Labile Solution Inhibitors and Positive- and Negative-Acting Photosensitive Composition Based Thereon
Patent:
5,380,881 →
Application:
08/007,420 →
Phenylacetates and the Use Thereof
Patent:
5,380,882 →
Application:
08/040,230 →
Photoresist Material Based on Polystryenes
Patent:
5,324,804 →
Application:
08/051,720 →
Positive Photoresists with Enhanced Resolution and Reduced Crystallisation Containing Novel Tetra(Hydroxyphenyl)Alkanes
Patent:
5,436,098 →
Application:
08/180,180 →
Module in an Integrated Delivery System for Chemical Vapors from Liquid Sources
Patent:
5,399,200 →
Application:
08/209,090 →
A Process of Photopatterning a Substrate with a Positive Photoresist Composition Containing a Diazoquinone Photosensitizer
Patent:
5,399,463 →
Application:
08/227,831 →
Positive Photoresist Having Improved Processing Properties
Patent:
5,397,680 →
Application:
08/249,972 →
Phenylacetates and Their Use in Radiation Sensitive Compositions
Patent:
5,476,751 →
Application:
08/323,482 →
Photoresist Compositions Containing Copolymers Having Acid-Labile Groups and Recurring Units Derived from Either N-(Hydroxymethyl)Maleimide or N-(Acetoxymethyl)Maleimide or Both
Patent:
5,558,978 →
Application:
08/358,131 →
Tetra(Hydroxphenyl)Alkanes
Patent:
5,554,797 →
Application:
08/399,686 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Apr 16, 1985
From: MERREM, HANS-JOACHIM; NEISIUS, KARLHEINZ; KLUG, RUDOLF; HARTNER, HARTMUT
To: MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG
Reel/Frame 004388/0357 →
Assignment of Assignors Interest.
Aug 11, 1986
From: CIBA-GEIGY AG, A SWISS COMPANY
To: CIBA-GEIGY CORPORATION, A CORP OF NY.
Reel/Frame 004590/0154 →
Assignment of Assignors Interest.
Dec 10, 1987
From: CIBA-GEIGY AG
To: CIBA-GEIGY CORPORATION, 444 SAW MILL RIVER ROAD, ARDSLEY, NEW YORK 10502, A NY CORP.
Reel/Frame 004797/0456 →
Assignment of Assignors Interest.
Jan 29, 1988
From: MERREM, HANS-JOACHIM; KLUG, RUDOLF; BINDER, HORST
To: MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG
Reel/Frame 004824/0616 →
Assignment of Assignors Interest.
Mar 16, 1988
From: HAAS, GUNTHER; NEISIUS, KARL H.
To: MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG
Reel/Frame 004838/0189 →
Assignment of Assignors Interest.
Jun 9, 1988
From: CIBA-GEIGY AG
To: CIBA-GEIGY CORPORATION
Reel/Frame 004894/0244 →
Assignment of Assignors Interest.
Dec 14, 1988
From: CIBA-GEIGY AG
To: CIBA-GEIGY CORPORATION, 444 SAW MILL RIVER RD., ARDSLEY, NY. 10502, A CORP. OF NY.
Reel/Frame 005189/0430 →
Assignment of Assignors Interest.
Feb 8, 1989
From: CIBA-GEIGY AG
To: CIBA-GEIGY CORPORATION, A NEW YORK CORP.
Reel/Frame 005008/0547 →
Assignment of Assignors Interest.
Apr 18, 1989
From: MERCK PATENT GMBH
To: CIBA-GEIGY CORPORATION
Reel/Frame 005048/0308 →
Assignment of Assignors Interest.
Jun 16, 1989
From: CIBA-GEIGY AG, 4002 BASLE, SWITZERLAND, A COMPANY OF THE SWISS CONFEDERATION
To: CIBA-GEIGY CORPORATION
Reel/Frame 005216/0068 →
Change of Name
Apr 18, 1997
From: OCG MICROELECTRONIC MATERIALS, INC.
To: OLIN MICROELECTRONIC CHEMICALS, INC.
Reel/Frame 008495/0994 →