Chemical vapor deposition apparatus and deposition method
A chemical vapor deposition apparatus includes a deposition chamber defined at least in part by at least one of a chamber sidewall and a chamber base wall. A substrate holder is received within the chamber. At least one process chemical inlet to the deposition chamber is included. At least one of the chamber sidewall and chamber base wall includes a chamber surface having a plurality of purge gas inlets to the chamber therein. The purge gas inlets are separate from the at least one process chemical inlet. A purge gas inlet passageway is provided in fluid communication with the purge gas inlets. Further implementations, including deposition method implementations, are contemplated.
1. A chemical vapor deposition apparatus comprising:
a deposition chamber defined at least in part by a chamber sidewall and a chamber base wall;
a substrate holder within the chamber;
at least one process chemical inlet to the deposition chamber, the at least one process chemical inlet passing through a chamber lid which opposes the chamber base wall;
a chamber outlet;
at least one of the chamber sidewall and chamber base wall comprising a chamber surface having a plurality of purge gas inlets to the chamber therein, the purge gas inlets being separate from the at least one process chemical inlet;
a purge gas inlet passageway in fluid communication with the purge gas inlets; and
wherein the purge gas inlets are of at least two different inlet sizes, at least some of the purge gas inlets further from the chamber outlet being larger than at least some of the purge gas inlets closer to the chamber outlet.
2. The apparatus of claim 1 wherein the purge gas inlet passageway comprises a plenum chamber to the purge gas inlets.
3. The apparatus of claim 1 wherein the purge gas inlets are configured for discharging purge gas to the chamber in a direction substantially transverse to the chamber surface.
4. The apparatus of claim 1 wherein the purge gas inlets are configured for discharging purge gas to the chamber in a direction substantially along the chamber surface.
5. The apparatus of claim 1 wherein the substrate holder has an upper surface over which a substrate to be deposited upon within the chamber is to be received, the deposition chamber has a sidewall, the chamber surface having the plurality of purge gas inlets being on the chamber sidewall, the chamber surface extending from elevationally higher than the substrate holder upper surface to elevationally lower than the substrate holder upper surface, the plurality of purge gas inlets being received at least elevationally lower than the substrate holder upper surface.