Structure for reduced gate capacitance in a JFET
View Patent ↗A junction field effect transistor (JFET) with a reduced gate capacitance. A gate definition spacer is formed on the wall of an etched trench to establish the lateral extent of an implanted gate region for a JFET. After implant, the gate is annealed. In addition to controlling the final junction geometry and thereby reducing the junction capacitance by establishing the lateral extent of the implanted gate region, the gate definition spacer also limits the available diffusion paths for the implanted dopant species during anneal. Also, the gate definition spacer defines the walls of a second etched trench that is used to remove a portion of the p-n junction, thereby further reducing the junction capacitance.
1. A JFET comprising:
a gate definition spacer adjacent to a corresponding trench wall surface, wherein said corresponding trench wall surface defines one side of a trench previously formed in a substrate, said trench comprising a bottom surface adjacent to said substrate, wherein said corresponding trench wall surface forms a boundary between said gate definition spacer and a source region adjacent to said gate definition spacer; and
an implanted gate region formed below said bottom surface of said trench, wherein said implanted gate region comprises at least one rounded p-n junction interface formed at a corner of said implanted gate region due to annealing, wherein said implanted gate region extends laterally such that at least a segment of the rounded p-n junction interface closest to the trench wall surface is substantially co-planar with said corresponding trench wall surface and a channel width of a channel region for said JFET is approximately equal to a width of said source region between trench walls of said JFET.
2. The JFET of claim 1 wherein said JFET is an n-channel JFET.
3. The JFET of claim 2 wherein said JFET is an enhancement mode JFET.
4. The JFET of claim 2 wherein said JFET is a depletion mode JFET.
5. The JFET of claim 1 wherein said JFET is a p-channel JFET.
6. The JFET of claim 5 wherein said JFET is an enhancement mode JFET.
7. The JFET of claim 5 wherein said JFET is a depletion mode JFET.
8. A JFET comprising:
a gate definition space adjacent to a corresponding trench wall surface, wherein said corresponding trench wall surface defines one side of a trench previously formed in a substrate, said trench comprising a bottom surface adjacent to said substrate, wherein said corresponding trench wall surface forms a boundary between said gate definition spacer and a source region; and
an implanted gate region formed below said bottom surface of said trench, wherein said implanted gate region comprises at least one rounded p-n junction interface formed at a corner of said implanted gate region due to annealing, wherein said implanted gate region extends laterally such that at least a segment of the rounded p-n junction interface closest to the trench wall surface is substantially co-planar with said corresponding trench wall surface and a channel width of a channel region for said JFET is approximately equal to a width of said source region between trench walls of said JFET; and
a gate surface reduction trench formed in said implanted gate region.
9. The JFET of claim 8 wherein said JFET is an n-channel JFET.
10. The JFET of claim 9 wherein said JFET is an enhancement mode JFET.
11. The JFET of claim 9 wherein said JFET is a depletion mode JFET.
12. The JFET of claim 8 wherein said JFET is a p-channel JFET.
13. The JFET of claim 12 wherein said JFET is an enhancement mode JFET.
14. The JFET of claim 12 wherein said JFET is a depletion mode JFET.
15. A transistor structure comprising:
a) a semiconducting substrate further comprising a drain region and a source region;
b) at least one gate region forming a p-n junction with a channel between said source region and said drain region;
c) a gate definition spacer adjacent to a corresponding trench wall surface, wherein said corresponding trench wall surface defines one side of a trench previously formed in a substrate wherein said corresponding trench wall surface forms a boundary between said gate definition spacer and a source region adjacent to said gate definition spacer, and wherein said at least one gate region comprises at least one rounded p-n junction interface formed at a corner of said implanted gate region due to annealing, wherein said at least one gate region extends laterally towards said channel such that at least a segment of the rounded p-n junction interface closest to the trench wall surface is substantially co-planar with said corresponding trench wall surface and a channel width for said channel is approximately equal to a width of said source region between trench walls of said transistor structure; and
d) a gate surface reduction trench formed in said implanted gate region.
16. The transistor structure of claim 15 wherein said semiconducting substrate is an n-type substrate.
17. The transistor structure of claim 16 wherein said structure includes two gate regions having merged depletion regions.
18. The transistor structure of claim 16 wherein said structure includes two gate regions, wherein each of said gate regions has an associated depletion region, and wherein said depletion regions are separated by a conductive channel.
19. The transistor structure of claim 15 wherein said semiconducting substrate is a p-type substrate.
20. The transistor structure of claim 19 wherein said structure includes two gate regions having merged depletion regions.
21. The transistor structure of claim 19 wherein said structure includes two gate regions, wherein each of said gate regions has an associated depletion region, and wherein said depletion regions are separated by a conductive channel.