Schottky diode with silver layer contacting the ZnO and MgxZn1-xO films
View Patent ↗In the present invention, there is provided semiconductor devices such as a Schottky UV photodetector fabricated on n-type ZnO and Mg x Zn 1-x O epitaxial films. The ZnO and Mg x Zn 1-x O films are grown on R-plane sapphire substrates and the Schottky diodes are fabricated on the ZnO and Mg x Zn 1-x O films using silver and aluminum as Schottky and ohmic contact metals, respectively. The Schottky diodes have circular patterns, where the inner circle is the Schottky contact, and the outside ring is the ohmic contact. Ag Schottky contact patterns are fabricated using standard liftoff techniques, while the Al ohmic contact patterns are formed using wet chemical etching. These detectors show low frequency photoresponsivity, high speed photoresponse, lower leakage current and low noise performance as compared to their photoconductive counterparts. This invention is also applicable to optical modulators, Metal Semiconductor Field Effect Transistors (MESFETs) and more.
1. A semiconductor device comprising:
a (11{overscore (2)}0) ZnO semiconductor epitaxial film grown on a single crystal substrate having an orientation wherein a primary symmetric axis (0001) of said (11{overscore (2)}0) ZnO semiconductor epitaxial film lies on the surface of said substrate, thereby resulting in zero net charge on said (11{overscore (2)}0) ZnO film and zero net dipole moment perpendicular to surface of said (11{overscore (2)}0) ZnO film and
a metal layer deposited on said film to form a Schottky contact.
2. The device of claim 1 wherein lattice mismatch between said (11{overscore (2)}0) ZnO semiconductor film and the substrate is small.
3. The device of claim 1 wherein said substrate is R-plane sapphire, i.e., (01{overscore (1)}2) Al 2 O 3 .
4. The device of claim 1 wherein said metal layer is silver forming the Schottky contact.
5. The device of claim 1 further comprising of an ohmic metal layer deposited on said semiconductor film to form an ohmic contact.
6. The device of claim 5 wherein said ohmic metal is aluminum.
7. A semiconductor device comprising:
a (11{overscore (2)}0) Ma x Zn 1-x O semiconductor epitaxial film grown on a single crystal substrate having an orientation wherein a Primary symmetric axis (0001) of said (11{overscore (2)}0) Mg x Zn 1-x O semiconductor epitaxial film lies on the surface of said substrate, thereby resulting in zero net charge on said (11{overscore (2)}0) Mg x Zn 1-x O film and zero net dipole moment perpendicular to surface of said (11{overscore (2)}0) Mg x Zn 1-x O film; and
a metal layer deposited on said (11{overscore (2)}0) Mg x Zn 1-x O film to form a Schottky contact.
8. A semiconductor Schottky diode, comprising:
a (11{overscore (2)}0) ZnO semiconductor epitaxial film grown on a single crystal substrate having an orientation wherein the primary symmetric axis (0001) of said (11{overscore (2)}0) ZnO semiconductor epitaxial film lies on surface of said substrate, thereby resulting in zero net charge on said (11{overscore (2)}0) ZnO film and zero net dipole moment perpendicular to surface of said (11{overscore (2)}0) ZnO film;
a metal deposited on said (11{overscore (2)}0) ZnO film to form a Schottky contact; and
an ohmic metal deposited on said (11{overscore (2)}0) ZnO film to form an ohmic contact.
9. The Schottky diode of claim 8 wherein the substrate is R-plane sapphire, i.e., (01{overscore (1)}2) Al 2 O 3 .
10. The Schottky diode of claim 9 wherein the lattice mismatch between the said substrate and said (11{overscore (2)}0) ZnO semiconductor film is small.
11. The Schottky diode of claim 8 wherein said metal is silver.
12. The Schottky diode of claim 8 wherein said ohmic metal is aluminum.
13. The Schottky diode of claim 8 having means to being applied as the low leakage and high speed ultraviolet photodetector.
14. A semiconductor Schottky diode, comprising:
a (11{overscore (2)}0) Mg x Zn 1-x O semiconductor film grown on a single crystal substrate having an orientation wherein primary symmetric axis (0001) of said (11{overscore (2)}0) Mg x Zn 1-x O semiconductor epitaxial film lies on surface of said substrate, thereby resulting in zero net charge on said (11{overscore (2)}0) Mg x Zn 1-x O film and zero net dipole moment perpendicular to surface of said (11{overscore (2)}0) Mg x Zn 1-x O film;
a metal deposited on said (11{overscore (2)}0) Mg x Zn 1-x O film to form a Schottky contact; and
an ohmic metal deposited on said (11{overscore (2)}0) Mg x Zn 1-x O film to form an ohmic contact.
15. A method of fabricating a semiconductor Schottky diode comprising:
growing a (11{overscore (2)}0) ZnO semiconductor epitaxial film on a plane of a single crystal substrate wherein primary symmetric axis (0001) of said (11{overscore (2)}0) ZnO semiconductor epitaxial film lies on said plane of said substrate thereby resulting in zero net charge on said (11{overscore (2)}0) ZnO film and zero net dipole moment perpendicular to surface of said (11{overscore (2)}0) ZnO film;
depositing a layer of Schottky metal on said substrate to form a Schottky contact; and
placing an ohmic metal on said substrate to form an ohmic contact.
16. The method of claim 15 wherein lattice mismatch between the (11{overscore (2)}0) ZnO semiconductor and the substrate is small.
17. The method of claim 15 wherein said plane is (01{overscore (1)}2) R-plane sapphire and said single substrate is Al 2 O 3 .
18. The method of claim 15 wherein said Schottky metal is silver.
19. The method of claim 15 wherein said ohmic metal is aluminum.
20. A method of fabricating a semiconductor Schottky diode comprising:
growing a (11{overscore (2)}0) Mg x Zn 1-x O semiconductor epitaxial film on a plane of a single crystal substrate wherein primary symmetric axis (0001) of said (11{overscore (2)}0) Mg x Zn 1-x O semiconductor epitaxial film lies on said plane of said substrate thereby resulting in zero net charge on said (11{overscore (2)}0) Mg x Zn 1-x O film and zero net dipole moment perpendicular to surface of said (11{overscore (2)}0) Mg x Zn 1-x O film;
depositing a layer of Schottky metal on said substrate to form a Schottky contact; and
placing an ohmic metal on said substrate to form an ohmic contact.