IP Library Granted Patent US 7,087,187
Granted Patent B2
US 7,087,187 · App. 10/164,916 · Granted Aug 8, 2006

Meta oxide coated carbon black for CMP

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Quick Facts
Patent No.
US 7,087,187
App. No.
10/164,916
Granted
Aug 8, 2006
Kind
B2
Abstract

Using coated carbon black particles, coated with a selected coating material, as an abrasive in slurries or polishing pads for chemical-mechanical polishing processes. By adjusting the coating material on the carbon black particles, new abrasive particles for chemical-mechanical polishing are created with tailored performance properties.

Claims (8)

1. A chemical-mechanical polishing slurry comprising abrasive particles dispersed in an aqueous medium wherein the abrasive particles are carbon black coated with a coating material, and wherein the coating material is a metal oxide, the slurry further including at least one ingredient selected from the group consisting of an oxidizing agent, a film forming agent, a stopping compound and an organic acid.

2. The chemical-mechanical polishing slurry of claim 1 wherein the coating material is selected from the group consisting of silica oxide, ceria oxide, titanium oxide, zirconium oxide, alumina oxide, and germania oxide.

3. The chemical-mechanical polishing slurry of claim 1 wherein at least 10% of the surface of the carbon black is covered with the coating material.

4. The chemical-mechanical polishing slurry of claim 1 wherein the abrasive particles are less than 10 micrometers in size.

5. The chemical mechanical polishing slurry of claim 4 wherein the abrasive particles are less than 1 micrometer in size.

6. The chemical mechanical polishing slurry of claim 1 wherein the slurry comprises from about 0.1% to about 20% (w/w) of abrasive particles.

7. The chemical-mechanical polishing slurry of claim 1 wherein the organic acid is selected from the group consisting of phosphoric acid, carbonic acid, mono-carboxylic acid, di-carboxylic acid or poly-carboxylic acid.

8. The chemical-mechanical polishing slurry of claim 1 wherein the slurry has a pH from about 1.0 to about 8.0.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →