IP Library Granted Patent US 6,861,786
Granted Patent B2
US 6,861,786 · App. 10/173,944 · Granted Mar 1, 2005

Saw device

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Quick Facts
Patent No.
US 6,861,786
App. No.
10/173,944
Granted
Mar 1, 2005
Kind
B2
Abstract

A SAW device includes a piezoelectric substrate, and an electrode having a first metal film which is formed over the piezoelectric substrate and is made with a first material, and second metal films which are formed over side walls of the first metal film and are made with a second material which is different from the first material.

Claims (24)

1. A surface acoustic wave (SAW) device comprising:

a piezoelectric substrate; and

an electrode having a first film of a first metal formed over the piezoelectric substrate, and second films of a second metal formed over opposite side walls of the first film,

wherein the second metal is different from the first metal, and wherein an upper surface of the first film is not covered by the second films.

2. The SAW device according to claim 1 , wherein the electrode converts an incident electronic signal into a surface acoustic wave, and converts an incident surface acoustic wave into an electronic signal.

3. The SAW device according to claim 1 , further comprising:

a metal film including chromium formed between the first film and the piezoelectric substrate.

4. The SAW device according to claim 1 , further comprising:

an alloy film including the first and second metals, which is formed between the first and second films.

5. The SAW device according to claim 1 , wherein the first film is formed of two different metal films.

6. The SAW device according to claim 5 , wherein the metal films include titanium and aluminum, respectively.

7. A surface acoustic wave (SAW) device comprising:

a piezoelectric substrate;

an electrode having a first film of a first metal formed over the piezoelectric substrate, and second films of a second metal formed over opposite side walls of the first film, wherein the second metal is different from the first metal; and

a metal film including chromium formed between the first film and the piezoelectric substrate.

8. A surface acoustic wave (SAW) device comprising:

a piezoelectric substrate;

an electrode having a first film of a first metal formed over the piezoelectric substrate, and second films of a second metal formed over opposite side walls of the first film, wherein the second metal is different from the first metal; and

an alloy film including the first and second metals, which is formed between the first and second films.

9. A surface acoustic wave (SAW) device comprising:

a piezoelectric substrate; and

an electrode having a first film of a first metal formed over the piezoelectric substrate, and second films of a second metal formed over opposite side walls of the first film, wherein the second metal is different from the first metal,

wherein the first film is formed of two different metals.

10. The SAW device according to claim 9 , wherein the two different metals include titanium and aluminum, respectively.

Assignments (5)
MERGER Recorded Jan 25, 2016
From: INTELLECTUAL VENTURES FUND 77 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037577/0581 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2012
From: LAPIS SEMICONDUCTOR CO., LTD.
To: INTELLECTUAL VENTURES FUND 77 LLC
Reel/Frame 028093/0534 →
CHANGE OF NAME Recorded Jan 31, 2012
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027622/0360 →
CHANGE OF NAME Recorded Dec 11, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0540 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2002
From: HAKAMADA, SHINICHI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 013023/0598 →