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App. No. 10/179,218 · Confirmation No. 8060

RESIN-ENCAPSULATED SEMICONDUCTOR APPARATUS AND PROCESS FOR ITS FABRICATION

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2003-03-18 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2003-03-18 FOR Foreign Reference 22 View
2003-03-18 FOR Foreign Reference 7 View
2002-06-26 TRNA Transmittal of New Application 3 View
2002-06-26 A.PE Preliminary Amendment 7 View
2002-06-26 SPEC Specification 48 View
2002-06-26 CLM Claims 12 View
2002-06-26 ABST Abstract 1 View
2002-06-26 DRW Drawings-only black and white line drawings 3 View
2002-06-26 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/179,218
Filed
2002-06-26
Granted
2003-09-09
Pub. No.
US20020195725A1
Art Unit
2815
PTA
-62 days