Merger and Change of Name

Recorded: 2010-10-12 Received: 2010-10-12 Pages: 40

Assignor

RENESAS TECHNOLOGY CORP.

Executed: 2010-04-01

Assignee

RENESAS ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, 211-8668, JAPAN

Covered Properties (13)

Semiconductor Device

Application: 12/815,976 →

A Semiconductor Device

Application: 11/211,548 →

Method for Manufacturing a Semiconductor Device

Application: 11/211,547 →

Method for Evaluating Semiconductor Device Error and System for Supporting the Same

Application: 11/037,105 →

Semiconductor Device

Application: 11/000,442 →

Semiconductor Memory Device and Manufacturing Process for the Same

Application: 10/861,500 →

Storage Device Counting Error Correction

Application: 10/430,345 →

Semiconductor Device

Application: 10/411,130 →

Semiconductor Memory Device

Application: 10/268,709 →

Design Support Apparatus for Circuit Including Directional Coupler, Design Support Tool, Method of Designing Circuit, and Circuit Board

Application: 10/214,126 →

Resin-Encapsulated Semiconductor Apparatus and Process for Its Fabrication

Application: 10/179,214 →

Resin-Encapsulated Semiconductor Apparatus and Process for Its Fabrication

Application: 10/179,218 →

Semiconductor Memory Device with Block Alignment Function

Application: 09/779,610 →