IP Library › Patent Application 10191124
Patent Application Utility
App. No. 10/191,124 · Confirmation No. 7043

Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof

Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2004-09-07 ABN Abandonment 2 View
2004-02-18 CTNF Non-Final Rejection 7 View
2004-02-18 892 List of references cited by examiner 1 View
2004-02-18 SRFW Search information including classification, databases and other search related notes 1 View
2004-02-18 FWCLM Index of Claims 1 View
2004-01-16 SRNT Examiner's search strategy and results 2 View
2002-07-09 TRNA Transmittal of New Application 5 View
2002-07-09 A.PE Preliminary Amendment 10 View
2002-07-09 SPEC Specification 27 View
2002-07-09 CLM Claims 5 View
2002-07-09 ABST Abstract 1 View
2002-07-09 DRW Drawings-only black and white line drawings 22 View
2002-07-09 OATH Oath or Declaration filed 4 View
2002-07-09 TRNA Transmittal of New Application 5 View
2002-07-09 DRW Drawings-only black and white line drawings 22 View
2002-07-09 SPEC Specification 27 View
2002-07-09 CLM Claims 5 View
2002-07-09 ABST Abstract 1 View
2002-07-09 OATH Oath or Declaration filed 4 View
2002-07-09 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2002-07-09 WFEE Fee Worksheet (SB06) 1 View
2002-07-09 WFEE Fee Worksheet (SB06) 1 View
2002-07-09 WCLM Claims Worksheet (PTO-2022) 1 View
2002-07-09 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2002-07-09 CLM Claims 4 View
2002-07-09 REM Applicant Arguments/Remarks Made in an Amendment 5 View
2002-07-09 WFEE Fee Worksheet (SB06) 1 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
10/191,124
Filed
2002-07-09
Pub. No.
US20020177295A1
Art Unit
2813