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App. No. 10/193,289 · Confirmation No. 8901

METHOD OF MANUFACTURING A RESIN ENCAPSULATED SEMICONDUCTOR DEVICE TO PROVIDE A VENT HOLE IN A BASE SUBSTRATE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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Quick Facts
App. No.
10/193,289
Filed
2002-07-12
Granted
2004-07-20
Pub. No.
US20020182776A1
Art Unit
2827
PTA
-30 days