IP Library › Assignment 014557/0835
Patent Assignment
Reel/Frame 014557/0835

Assignment of Assignor's Interest

Recorded: 2003-09-26 Pages: 4
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (7)
Lead Frame and Semiconductor Device Using the Lead Frame and Method of Manufacturing the Same
Patent: 6,909,179 →
Application: 09/904,839 →
Publication: US 2001/0050419
Method of Manufacturing a Semiconductor Device
Patent: 6,835,596 →
Application: 09/965,221 →
Publication: US 2002/0038918
Fabrication Method of Semiconductor Integrated Circuit Device and Testing Method
Patent: 6,638,779 →
Application: 10/096,801 →
Publication: US 2002/0132381
Method of Manufacturing a Resin Encapsulated Semiconductor Device to Provide a Vent Hole in a Base Substrate
Patent: 6,764,878 →
Application: 10/193,289 →
Publication: US 2002/0182776
Method of Manufacturing Semiconductor Device
Patent: 6,759,279 →
Application: 10/214,313 →
Publication: US 2002/0192872
Fabrication Method of Semiconductor Integrated Circuit Device
Application: 10/266,769 →
Publication: US 2003/0082865
Fabrication Method of Semiconductor Integrated Circuit Device
Application: 10/364,506 →
Publication: US 2003/0148626
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 27, 2001
From: XIANG, YOUQING
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 012227/0130 →
Assignment of Assignor's Interest Sep 28, 2001
From: GOTOU, MASAKATSU; KASAI, NORIHIKO
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 012221/0872 →
Assignment of Assignor's Interest Mar 14, 2002
From: TAIRA, TOMOHIRO
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 012700/0979 →
Assignment of Assignor's Interest Oct 9, 2002
From: TAKAHASHI, OSAMU; OGASAWARA, KUNIO
To: HITACHI, LTD.; HITACHI KOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 013369/0365 →
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Change of Name May 4, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042247/0398 →
Change of Name May 4, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042405/0955 →
Merger and Change of Name May 4, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.; RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042406/0026 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →