Patent Assignment
Reel/Frame 012221/0872
Assignment of Assignor's Interest
Recorded: 2001-09-28
Pages: 2
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI HOKKAI SEMICONDUCTOR, LTD.
145, AZANAKAJIMA, NANAECHO, KAMEDA-GUN, HOKKAIDO, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 27, 2001
From: XIANG, YOUQING
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 012227/0130 →
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014557/0835 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Change of Name
May 4, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042247/0398 →
Merger and Change of Name
May 4, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.; RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042406/0026 →
Change of Name
May 4, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042405/0955 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →