IP Library › Patent Application 10195716
Patent Application Utility
App. No. 10/195,716 · Confirmation No. 7839

METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING A CONDUCTIVE LAYER TO PREVENT PEELING BETWEEN A BONDING PAD AND AN UNDERLYING INSULATING FILM

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2004-01-07 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-01-07 LET. Miscellaneous Incoming Letter 2 View
2002-07-16 TRNA Transmittal of New Application 4 View
2002-07-16 SPEC Specification 30 View
2002-07-16 CLM Claims 4 View
2002-07-16 ABST Abstract 1 View
2002-07-16 DRW Drawings-only black and white line drawings 20 View
2002-07-16 OATH Oath or Declaration filed 4 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
10/195,716
Filed
2002-07-16
Granted
2004-02-24
Pub. No.
US20030045088A1
Art Unit
2813
PTA
-49 days