Patent Assignment
Reel/Frame 013121/0368
Assignment of Assignor's Interest
Recorded: 2002-07-16
Pages: 2
Assignors
IMAI, TOSHINORI
Executed: 2002-06-03
FUJIWARA, TSUYOSHI
Executed: 2002-06-03
SHIRAISHI, TOMOHIRO
Executed: 2002-06-07
ASHIHARA, HIROSHI
Executed: 2002-06-03
YOSHIDA, MASAAKI
Executed: 2002-06-04
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Integrated Circuit Device Using a Conductive Layer to Prevent Peeling Between a Bonding Pad and an Underlying Insulating Film
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014244/0278 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →