Granted Patent
Utility
US 6,696,357 · App. 10/195,716
Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film
Inventors:
Toshinori Imai, Tsuyoshi Fujiwara, Tomohiro Shiraishi, Hiroshi Ashihara, Masaaki Yoshida
Patented Case
View Patent ↗
Granted: Feb 24, 2004
Filed: Jul 16, 2002
Inventors
Toshinori Imai
Tsuyoshi Fujiwara
Tomohiro Shiraishi
Hiroshi Ashihara
Masaaki Yoshida
Assignee (at issue)
Renesas Technology Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.