IP Library Granted Patent US 6,909,645
Granted Patent B2
US 6,909,645 · App. 10/196,401 · Granted Jun 21, 2005

Cluster based redundancy scheme for semiconductor memories

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Quick Facts
Patent No.
US 6,909,645
App. No.
10/196,401
Granted
Jun 21, 2005
Kind
B2
Abstract

In some embodiments, a cluster redundancy scheme may be implemented. Such a scheme may provide cluster segments including rows and columns of replacement memory elements to selectively replace defective elements arranged in rows, columns, or blocks in a main memory array of a semiconductor memory.

Claims (32)

1. A method comprising:

providing a cluster redundancy segment including redundant memory elements arranged in rows and columns; and

replacing defective memory elements within a main memory array of a semiconductor memory by assigning elements in said cluster redundancy segment to emulate one of row repair, column repair, or block repair based on a type of the defective memory elements.

2. The method of claim 1 wherein replacing defective memory elements includes replacing defective memory elements arranged in a row with a row from said cluster redundancy segment.

3. The method of claim 1 wherein replacing defective memory elements includes replacing defective memory elements arranged in a column with a column of elements in said cluster redundancy segment.

4. The method of claim 3 including using a plurality of columns in said cluster redundancy segment to replace a column of defective memory elements in a main memory array.

5. The method of claim 1 including detecting an address signal and determining whether said address signal addresses a memory element in said main array which has been replaced with a redundant memory element in said cluster redundancy segment.

6. The method of claim 5 including outputting data from a redundant array when the address signal addresses an element in said main array which is defective.

7. The method of claim 6 including detecting said address signal at a redundancy matching circuit that compares redundancy implementation information with said address signal.

8. The method of claim 7 including receiving said address signal in said redundancy matching circuit and said redundant array.

9. A semiconductor memory comprising:

a main array including a plurality of memory elements arranged in rows and columns;

a redundant array including at least one set of memory elements arranged in rows and columns; and

a device to determine if a defective cluster is addressed in said main array and to instead address a cluster of said redundant array to emulate one of row repair, column repair, and block repair based on a type of the defective cluster.

10. The memory of claim 9 wherein said device to replace a row in said main array with a row in said redundant array.

11. The memory of claim 10 wherein said device to replace a row in said main array with a plurality of rows in said redundant array.

12. The memory of claim 9 wherein said device to replace a column in said main array with a column in said redundant array.

13. The memory of claim 12 wherein said device to replace a column in said main array with a plurality of columns in said redundant array.

14. The memory of claim 9 including a redundancy matching circuit coupled to receive array address signals.

15. The memory of claim 14 wherein said redundant array is coupled to said redundancy matching circuit.

16. The memory of claim 14 wherein said redundant array is coupled to receive said array address signals.

17. A processor-based system comprising:

a processor;

a semiconductor memory coupled to said processor including a main array with a plurality of memory elements arranged in rows and columns, a redundant array including at least one set of memory elements arranged in rows and columns, and a device to determine if a defective cluster is addressed in said main array and instead to address a cluster of said redundant array to emulate one of row repair, column repair, and block repair based on a type of the defective cluster; and

a wireless interface coupled to said processor.

18. The system of claim 17 wherein said device to replace a row in said main array with a row in said redundant array.

19. The system of claim 18 wherein said device to replace a row in said main array with a plurality of rows in said redundant array.

20. The system of claim 17 including said device to replace a column in said main array with a column in said redundant array.

21. The system of claim 20 including said device to replace a column in said main array with a plurality of columns in said redundant array.

22. The system of claim 17 including a redundancy matching circuit coupled to receive array address signals.

23. The system of claim 22 wherein said redundant array is coupled to said redundancy matching circuit.

24. The system of claim 22 wherein said redundant array is coupled to receive said array address signals.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →