IP Library Granted Patent US 6,891,665
Granted Patent B2
US 6,891,665 · App. 10/197,107 · Granted May 10, 2005

Semiconductor optical amplifier with reduced effects of gain saturation

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Quick Facts
Patent No.
US 6,891,665
App. No.
10/197,107
Granted
May 10, 2005
Kind
B2
Abstract

An active optical device with reduced axial carrier depletion is disclosed. This active optical device includes a substrate layer; a p-doped active layer coupled to the substrate, a semiconductor layer coupled to the active layer, an electrical contact coupled to the substrate layer, and an electrical contact coupled to the semiconductor layer. The p-doped active layer has a central interaction region and a transverse diffusion region. The transverse diffusion region supplies additional carriers to the central interaction region in response to carrier depletion in the central interaction region caused by the interaction of the carriers with a light beam. Also a method of operation and a method of manufacture for the active optical device is disclosed.

Claims (44)

1. An active optical device with reduced axial carrier depletion, comprising:

substrate layer;

a p-doped active layer coupled to the substrate, including;

a central interaction region including carriers for interaction with a light beam; and

a transverse diffusion region which supplies additional carriers to the central interaction region responsive to carrier depletion in the central interaction region;

a semiconductor layer coupled to the active layer;

a first electrical contact coupled to the substrate layer; and

a second electrical contact coupled to the semiconductor layer.

2. The active optical device of claim 1 , wherein the semiconductor layer is sized and shaped to substantially confine the light beam within the central interaction region of the active layer.

3. An active optical device with reduced axial carrier depletion, comprising:

a substrate layer;

a p-doped active layer coupled to the substrate, including;

a central interaction region including carriers for interaction with a light beam; and

a transverse diffusion region which supplies additional carriers to the central interaction region responsive to carrier depletion in the central interaction region;

a semiconductor layer coupled to the active layer, including;

a cladding sub-layer formed on the active layer; and

a contact sub-layer coupled to the cladding sub-layer;

a first electrical contact coupled to the substrate layer; and

a second electrical contact coupled to the contact sub-layer of the semiconductor layer.

4. The active optical device of claim 3 , wherein the cladding sub-layer of the semiconductor layer is formed as a ridge structure to substantially confine the light beam within the central interaction region of the active layer.

5. The active optical device of claim 3 , wherein the contact sub-layer of the semiconductor layer is formed at a p ++ -doped III/V material.

6. The active optical device of claim 1 , wherein the carriers of the central interaction region of the p-doped active layer interact with the light beam to amplify the light beam.

7. The active optical device of claim 1 , wherein the carriers of the central interaction region of the p-doped active layer interact with the light beam to attenuate the light beam.

8. The active optical device of claim 1 , wherein the p-doped active layer includes a plurality of sub-layers forming a quantum well structure.

9. The active optical device of claim 1 , wherein the p-doped active layer is formed of a p-doped III/V material.

10. The active optical device of claim 1 , wherein:

the first electrical contact is selected from a group consisting of: aluminum; gold; sliver; copper; nickel; titanium; tungsten; platinum; beryllium; germanium; polyaniline; and polysilicon; and

the second electrical contact is selected from a group consisting of: aluminum; gold; silver; copper; nickel; titanium; tungsten; platinum; beryllium; germanium; polyaniline; and polysilicon.

11. An active optical device with reduced axial carrier depletion, comprising:

a substrate layer;

a p-doped active layer coupled to the substrate, including:

a central interaction region including carriers for interaction with a light beam; and

a transverse diffusion region which supplies additional carriers to the central interaction region responsive to carrier depletion in the central interaction region;

a semiconductor layer coupled to the active layer;

a first electrical contact coupled to the substrate layer;

a second electrical contact coupled to the semiconductor layer; and

a dielectric protection layer coupled to the substrate and the transverse diffusion region of the p-doped active layer.

12. The active optical device of claim 11 , wherein the dielectric protection layer is selected from a group consisting of: an undoped III/V material; polyimide; SiO 2 ; SiN; and alumina.

13. A method for minimizing pulse shape distortion and chirp of an optical signal amplified by a semiconductor optical amplifier device (SOA) which includes a p-doped active layer including an amplification region and a transverse diffusion region, the method comprising the steps of:

a) coupling the optical signal into, and substantially confining the optical signal within, the amplification region of the p-doped active layer of the SOA, the amplification region having a plurality of carriers;

b) amplifying the optical signal with the plurality of carriers; and

c) minimizing pulse shape distortion and chirp of the amplified optical signal by supplying additional electrons from the transverse diffusion region to the amplification region of the p-doped active layer;

thereby reducing carrier depletion within the amplification region.

14. The method of claim 13 , wherein the SOA is configured to handle optical pulses with a rise time ≦1 ps.

Assignments (12)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2014
From: CYOPTICS, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 032159/0790 →
RELEASE OF SECURITY INTEREST Recorded Jun 28, 2013
From: SILICON VALLEY BANK
To: CYOPTICS, INC.
Reel/Frame 030707/0468 →
SECURITY AGREEMENT Recorded Jan 7, 2010
From: CYOPTICS, INC.
To: SILICON VALLEY BANK
Reel/Frame 023741/0945 →
SECURITY AGREEMENT Recorded Aug 21, 2007
From: CYOPTICS, AQUISITION CORP. F/K/A T-NETWORKS, INC.
To: COMERICA BANK
Reel/Frame 019725/0366 →