Resin encapsulation semiconductor device utilizing grooved leads and die pad
View Patent ↗A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.
1. A resin-encapsulation semiconductor device comprising:
a die pad for mounting a semiconductor element;
a plurality of supporting leads for supporting the die pad;
a semiconductor element mounted on the die pad;
a plurality of leads arranged to have tips thereof opposing the die pad;
metal wires for respectively connecting electrodes of the semiconductor element to upper faces of the leads; and
an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element,
wherein the outside edges of the leads are disposed on substantially the same plane as a side face of the encapsulation resin,
each of the tips of the leads opposing the die pad has a thin portion where a thickness is reduced in an upper face thereof, and
entire lower faces of the leads are planer.
2. The resin-encapsulation semiconductor device of claim 1 , wherein the thin portion of each of the tips of the leads has the thickness reduced to substantially a half of a thickness of the leads.
3. The resin-encapsulation semiconductor device of claim 1 , wherein the thin portion of each of the tips of the leads has a gently inclined face formed by reducing the thickness in the upper face thereof to substantial a half of a thickness of the leads.
4. The resin-encapsulation semiconductor device of claim 1 , wherein a periphery of the semiconductor element mounted on the die pad is close to the thin portions of the tips of the leads.
5. The resin-encapsulation semiconductor device of claim 1 , wherein a groove is provided on the upper face of each of the leads.
6. The resin-encapsulation semiconductor device of claim 5 , wherein each of the metal wires for connecting the electrodes of the semiconductor element to the upper faces of the leads is connected to a portion on the upper face of each of the leads in a position close to the groove provided thereon.
7. The resin-encapsulation semiconductor device of claim 1 , wherein a groove is provided on the bottom of the die pad.
8. The resin-encapsulation semiconductor device of claim 1 , wherein each of the metal wires for connecting the electrodes of the semiconductor element to the upper faces of the leads is connected to a portion on the upper face of each of the leads in a position away from the thin portion.
9. The resin-encapsulation semiconductor device of claim 1 , wherein an upper face of the die pad is disposed at the same level as the upper faces of the leads excluding the thin portions.
10. The resin-encapsulation semiconductor device of claim 1 , wherein the resin-encapsulation semiconductor device is in a rectangular parallelepiped shape.