Address sequencer within BIST (Built-in-Self-Test) system

1. A method for sequencing through flash memory cells fabricated on a semiconductor substrate, including the steps of:

fabricating a plurality of logic units of an address sequencer control logic and address sequencer buffers on the semiconductor substrate;

generating a plurality of bits by the buffers for indicating an address of the flash memory cells; and

controlling, by a respective different logic unit of the control logic, the buffers to sequence through a respective different sequence of bit patterns for each of a plurality of different types of BIST (built-in-self-test) modes,

wherein a different unique logic unit controls the buffers to sequence through a different unique sequence of bit patterns for each of the different types of BIST modes.

2. The method of claim 1 , further including the steps of:

generating first bits by a first group of the buffers for indicating a Y-address for a flash memory cell;

generating second bits by a second group of the buffers for indicating an X-address for a flash memory cell; and

generating third bits by a third group of the buffers for indicating a sector address for a flash memory cell.

3. The method of claim 2 , further including the step of:

generating fourth bits by a fourth group of the buffers for indicating a redundancy block address for a flash memory cell;

wherein each redundancy block is comprised of a plurality of sectors of the flash memory cells;

and wherein when a BIST mode is for testing each sector, with a last sector being divided into subsectors, the control logic controls the second group of the buffers to sequence through each subsector of the last sector, and controls the third and fourth groups of the buffers to sequence through each of the other sectors aside from the last sector.

4. The method of claim 2 , wherein at the start of a BIST mode, the method further includes the steps of:

resetting the first group of the buffers to indicate a beginning Y-address;

resetting the second group of the buffers to indicate a beginning X-address; and

resetting the third group of the buffers to indicate a beginning sector address.

5. The method of claim 2 , further including the step of:

controlling, by the control logic, the second group of the buffers to invert a bit pattern of the second bits for achieving physically adjacent sequencing of X-addresses when two adjacent X-address decoders are fabricated as mirror-images of each-other on the semiconductor substrate.

6. The method of claim 2 , further including the steps of:

controlling, by the control logic, the first group of the buffers to sequence through each Y-address for an X-address before the X-address is incremented when an Xmimnax control signal is asserted; and

controlling, by the control logic, the second group of the buffers to sequence through each X-address for a Y-address before the Y-address is incremented when a Yminmax control signal is asserted.

7. The method of claim 2 , wherein when a BIST mode is for checker-board access of the flash memory cells, the method further includes the steps of:

controlling, by the control logic, the first group of the buffers not including the least significant bit to increment such that alternating flash memory cells within a row are accessed; and

controlling, by the control logic, the first group of the buffers to toggle the least significant bit once at the increment of the second group of the buffers such that alternating flash memory cells within a column are accessed.

8. The method of claim 2 , wherein when a BIST mode is for diagonal access of the flash memory cells, the method further includes the steps of:

initializing, by the control logic, the first and second groups of the buffers to a beginning Y-address and a beginning X-address; and

controlling, by the control logic, the first and second groups of the buffers to increment for each clock cycle such that flash memory cells of diagonal location are accessed.

9. The method of claim 1 , wherein when a BIST mode is for accessing OTP (one time programmable) flash memory cells, the method further includes the step of:

coupling a group of the buffers to a register of a BIST interface for indicating an address of an OTP flash memory cell to be accessed by an external test system.

10. The method of claim 1 , further including the step of:

fabricating a redundancy sequencing enable logic on the semiconductor substrate for determining whether redundancy flash memory cells fabricated on the semiconductor substrate are to be sequenced.

11. The method of claim 10 , further including the step of:

determining by the redundancy sequencing enable logic that the redundancy flash memory cells are not to be sequenced if (A) a BIST mode is for diagonal program of the flash memory cells, (B) a BIST mode is for diagonal erase verify of the flash memory cells, (C) all available redundancy flash memory cells have already been used, or (D) a manual test mode is invoked.

12. The method of claim 1 , wherein when a BIST mode is for trimming reference cells, the method further includes the steps of:

coupling, by the control logic, a bit pattern from a register of a BIST interface to a group of the buffers for indicating an address of the reference cells to be erase trimmed.

13. The method of claim 12 , further including the steps of:

controlling, by the control logic, the group of the buffers to sequence through the reference cells to be erase trimmed with a first erase pulse voltage level ARVSS0 applied on a first subset of the reference cells and with a second erase pulse voltage level ARVSS1 applied on a second subset of the reference cells; and

decoupling the first erase pulse voltage level ARVSS0 from the first subset of the reference cells when the group of the buffers has sequenced through the first subset of the reference cells.

14. The method of claim 1 , further including the step of:

inputting, by the control logic, control signals from at least one of a BIST back-end state machine, a BIST interface, a BIST front-end interface decoder, and the buffers, for determining the respective sequence of bit patterns.

15. A system for sequencing through flash memory cells fabricated on a semiconductor substrate, comprising:

address sequencer buffers, fabricated on the semiconductor substrate, for generating a plurality of bits that indicate an address of the flash memory cells; and

a plurality of logic units of an address sequencer control logic, fabricated on the semiconductor substrate, a respective different logic unit controlling the buffers to sequence through a respective different sequence of bit patterns for each of a plurality of different types of BIST (built-in-self-test) modes,

wherein a different unique logic unit controls the buffers to sequence through a different unique sequence of bit patterns for each of the different types of BIST modes.

16. The system of claim 15 , wherein the buffers are comprised of:

a first group of the buffers for generating first bits that indicate a Y-address for a flash memory cell;

a second group of the buffers for generating second bits that indicate an X-address for a flash memory cell; and

a third group of the buffers for generating third bits that indicate a sector address for a flash memory cell.

17. The system of claim 16 , wherein the buffers are further comprised of:

a fourth group of the buffers for generating fourth bits that indicate a redundancy block address for each flash memory cell;

and wherein each redundancy block is comprised of a plurality of sectors of the flash memory cells;

and wherein when a BIST mode is for testing each sector, with a last sector being divided into subsectors, the control logic controls the second group of the buffers to sequence through each subsector of the last sector, and controls the third and fourth groups of the buffers to sequence through each of the other sectors aside from the last sector.

18. The system of claim 16 , wherein at the start of a BIST mode:

the first group of the buffers are reset to indicate a beginning Y-address;

the second group of the buffers are reset to indicate a beginning X-address; and

the third group of the buffers are reset to indicate a beginning sector address.

19. The system of claim 16 , wherein the control logic controls the second group of the buffers to invert a bit pattern of the second bits for achieving physically adjacent sequencing of X-addresses when two adjacent X-address decoders are fabricated as mirror-images of each-other on the semiconductor substrate.

20. The system of claim 16 , wherein:

the control logic controls the first group of the buffers to sequence through each Y-address for an X-address before the X-address is incremented when an Xminmax

control signal is asserted; and wherein the control logic controls the second group of the buffers to sequence through each X-address for a Y-address before the Y-address is incremented when a Yminmax control signal is asserted.

21. The system of claim 16 , wherein when a BIST mode is for checker-board access of the flash memory cells:

the control logic controls the first group of the buffers not including the least significant bit to increment such that alternating flash memory cells within a row are accessed;

and wherein the control logic controls the first group of the buffers to toggle the least significant bit once at the increment of the second group of the buffers such that alternating flash memory cells within a column are accessed.

22. The system of claim 16 , wherein when a BIST mode is for diagonal access of the flash memory cells:

the control logic initializes the first and second groups of the buffers to a beginning Y-address and a beginning X-address;

and wherein the control logic controls the first and second groups of the buffers to increment for each clock cycle such that flash memory cells of diagonal location are accessed.

23. The system of claim 15 , wherein when a BIST mode is for accessing OTP (one time programmable) flash memory cells:

a group of the buffers are coupled to a register of a BIST interface for indicating an address of an OTP flash memory cell to be accessed by an external test system.

24. The system of claim 15 , further comprising:

a redundancy sequencing enable logic, fabricated on the semiconductor substrate, for determining whether redundancy flash memory cells fabricated on the semiconductor substrate are to be sequenced.

25. The system of claim 24 , wherein the redundancy sequencing enable logic determines that the redundancy flash memory cells are not to be sequenced if (A) a BIST mode is for diagonal program of the flash memory cells, (B) a BIST mode is for diagonal erase verify of the flash memory cells, (C) all available redundancy flash memory cells have already been used, or (D) a manual test mode is invoked.

26. The system of claim 15 , wherein when a BIST mode is for trimming reference cells, the control logic couples a bit pattern from a register of a BIST interface to a group of the buffers for indicating an address of the reference cells to be erase trimmed.

27. The system of claim 26 , wherein:

the control logic controls the group of the buffers to sequence through the reference cells to be erase trimmed with a first erase pulse voltage level ARVSS0 applied on a first subset of the reference cells and with a second erase pulse voltage level ARVSS1 applied on a second subset of the reference cells;

and wherein the control logic decouples the first erase pulse voltage level ARVSS0 from the first subset of the reference cells when the group of the buffers has sequenced through the first subset of the reference cells.

28. The system of claim 15 , wherein the control logic inputs control signals from at least one of a BIST back-end state machine, a BIST interface, a BIST front-end interface decoder, and the buffers, for determining the respective sequence of bit patterns.