Substrate processing apparatus equipping with high-pressure processing unit
View Patent ↗With respect to any one of processing units, a main transportation path, a developing unit, a dedicated transportation robot and a high-pressure processing unit are disposed linearly in this order in a direction. Hence, even if a processing fluid adhering to a substrate or an evaporant of the processing fluid moves toward the main transportation path while the high-pressure processing unit transports the substrate wet with the processing fluid, there are the processing units located which the processing fluid or its evaporant must arrive at before reaching the main transportation path.
1. A substrate processing apparatus including a main transportation path, comprising:
a wet processing unit which is disposed facing said main transportation path, and which supplies a processing fluid to a substrate to process said substrate with a predetermined wet surface treatment;
a main transportation system which moves on said main transportation path, and which loads a substrate into and unloads a substrate out from said wet processing unit;
a high-pressure processing unit which is disposed away from said main transportation path with said wet processing unit located between said main transportation path and said high-pressure processing unit, and which causes a high-pressure fluid or a mixture of a high-pressure fluid and a chemical agent, as a processing fluid, to come into contact with a surface of a substrate treated with said wet surface treatment by said wet processing unit and accordingly processes a surface of said substrate with a high-pressure surface treatment; and
a dedicated transportation system which is disposed between said wet processing unit and said high-pressure processing unit, and which transports a substrate from said wet processing unit to said high-pressure processing unit.
2. The substrate processing apparatus of claim 1 , wherein said main transportation path, said wet processing unit, said dedicated transportation system and said high-pressure processing unit are linearly arranged in this order.
3. The substrate processing apparatus of claim 1 , wherein said high-pressure processing unit executes a drying process of drying a substrate as the last process of said surface treatment.
4. The substrate processing apparatus of claim 1 , wherein said dedicated transportation system transports said substrate having a wet surface to said high-pressure processing unit.
5. The substrate processing apparatus of claim 4 , wherein said dedicated transportation system transports said substrate on which said processing fluid stays.
6. The substrate processing apparatus of claim 4 , wherein said dedicated transportation system transports said substrate, which is housed in a transporting container filled with a moisturizing fluid, to said high-pressure processing unit.
7. A substrate processing apparatus including a main transportation path, comprising:
a plurality of wet processing units each of which is disposed facing said main transportation path, and each of which supplies a processing fluid to a substrate to process said substrate with a predetermined wet surface treatment, one of said wet processing units being a preprocessing unit;
a main transportation system which moves on said main transportation path, and which loads a substrate into and unloads a substrate out from said wet processing units;
a high-pressure processing unit which is disposed away from said main transportation path with said preprocessing unit located between said main transportation path and said high-pressure processing unit, and which causes a high-pressure fluid or a mixture of a high-pressure fluid and a chemical agent, as a processing fluid, to come into contact with a surface of a substrate treated with said wet surface treatment by said preprocessing unit and accordingly processes a surface of said substrate with a high-pressure surface treatment; and
a dedicated transportation system which is disposed between said preprocessing unit and said high-pressure processing unit, and which transports a substrate from said preprocessing unit to said high-pressure processing unit.
8. The substrate processing apparatus of claim 7 , wherein said main transportation path, said preprocessing unit, said dedicated transportation system and said high-pressure processing unit are linearly arranged in this order.
9. The substrate processing apparatus of claim 7 , wherein said high-pressure processing unit executes a drying process of drying a substrate as the last process of said surface treatment.
10. The substrate processing apparatus of claim 9 , wherein said dedicated transportation system transports said substrate on which said processing fluid stays.
11. The substrate processing apparatus of claim 9 , wherein said dedicated transportation system transports said substrate, which is housed in a transporting container filled with a moisturizing fluid, to said high-pressure processing unit.
12. The substrate processing apparatus of claim 7 , wherein said dedicated transportation system transports said substrate having a wet surface to said high-pressure processing unit.
13. The substrate processing apparatus of claim 7 , wherein said high-pressure processing unit uses a supercritical fluid as said processing fluid.
14. The substrate processing apparatus of claim 1 , wherein said high-pressure processing unit uses a supercritical fluid as said processing fluid.
15. A substrate processing apparatus including a main transportation path, comprising:
a plurality of wet processing units each of which is disposed facing said main transportation path, and each of which supplies a processing fluid to a substrate to process said substrate with a predetermined wet surface treatment;
a main transportation system which moves on said main transportation path, and which loads a substrate into and unloads a substrate out from said wet processing units;
a plurality of high-pressure processing units each of which is disposed away from said main transportation path with one said wet processing unit located between said main transportation path and said high-pressure processing unit, and each of which causes a high-pressure fluid or a mixture of a high-pressure fluid and a chemical agent, as a processing fluid, to come into contact with a surface of a substrate treated with said wet surface treatment by said one wet processing unit and accordingly processes a surface of said substrate with a high-pressure surface treatment; and
a dedicated transportation system which is disposed between said one wet processing unit and the corresponding said high-pressure processing unit, and which transports a substrate from said one wet processing unit to said corresponding high-pressure processing unit,
wherein said high-pressure processing units are disposed in juxtaposition.
16. The substrate processing apparatus of claim 15 , wherein said main transportation path, said one wet processing unit, said dedicated transportation means and said high-pressure processing unit are linearly arranged in this order.
17. The substrate processing apparatus of claim 15 , wherein said high-pressure processing unit executes a drying process of drying a substrate as the last process of said surface treatment.
18. The substrate processing apparatus of claim 15 , wherein said dedicated transportation system transports said substrate having a wet surface to said high-pressure processing unit.
19. The substrate processing apparatus of claim 18 , wherein said dedicated transportation system transports said substrate on which said processing fluid stays.
20. The substrate processing apparatus of claim 18 , wherein said dedicated transportation means transports said substrate, which is housed in a transporting container filled with a moisturizing fluid, to said high-pressure processing unit.
21. The substrate processing apparatus of claim 15 , wherein said high-pressure processing unit uses a supercritical fluid as said processing fluid.