IP Library › Granted Patent US 6,740,571
Granted Patent Utility
US 6,740,571 · Confirmation No. 6384

METHOD OF ETCHING A DIELECTRIC MATERIAL IN THE PRESENCE OF POLYSILICON

Inventor: Hua Ji
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Quick Facts
Patent No.
US 6,740,571
App. No.
10/202,992
Filed
2002-07-25
Granted
2004-05-25
Pub. No.
US20040018684A1
Art Unit
2812
PTA
-58 days