IP Library Granted Patent US 6,958,931
Granted Patent B1
US 6,958,931 · App. 10/209,116 · Granted Oct 25, 2005

Bit line control and sense amplification for TCCT-based memory cells

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Quick Facts
Patent No.
US 6,958,931
App. No.
10/209,116
Granted
Oct 25, 2005
Kind
B1
Abstract

A circuit and a method are provided for facilitating control of bit lines in preparation for, or during, sense amplification of data signals from thinly capacitively-coupled thyristor (“TCCT”)-based memory cells. In accordance with a specific embodiment, a circuit and method are designed, among other things, to effectively minimize power consumption by memory cells and to increase speed and reliability of sense amplification. In another specific embodiment, the circuit and method are directed to TCCT-based memory cells.

Claims (45)

1. A sensing circuit comprising:

a sense amplifier;

a TCCT-based memory cell;

a reference cell;

a bit line coupled between the sense amplifier and the TCCT-based memory cell;

a reference bit line coupled between the sense amplifier and the reference cell; and

a pre-charge device coupled to the bit line and configured to pre-charge the bit line.

2. The sensing circuit of claim 1 , wherein the sense amplifier includes

a memory node coupled to the bit line for receiving a memory signal from the TCCT-based memory cell, and

a reference node coupled to the reference bit line for receiving a reference signal from the reference cell; and

wherein the sense amplifier is configured to resolve the memory signal and the reference signal into complementary output signals.

3. The sensing circuit of claim 2 , further comprising a switchable memory node device coupled between the first node and the bit line.

4. The sensing circuit of claim 3 , wherein the switchable memory node device is a MOSFET device.

5. The sensing circuit of claim 1 , wherein the pre-charge device includes a switchable pre-charge device to couple the bit line to a pre-charge node maintained at a substantially constant potential.

6. The sensing circuit of claim 5 , wherein the substantially constant potential is approximately ground.

7. The sensing circuit of claim 5 , wherein the switchable pre-charge device includes a MOSFET device.

8. The sensing circuit of claim 1 , wherein the sense amplifier includes two cross-coupled inverters.

9. The sensing circuit of claim 8 , wherein the sense amplifier further includes a switchable sensing source device coupled between the sense amplifier and a second potential to enable operation of the sense amplifier.

10. The sensing circuit of claim 1 , further comprising a sense amplifier pre-charge device coupled to the sense amplifier.

11. The sensing circuit of claim 10 , wherein a sense amplifier pre-charge control signal is used to control the sense amplifier pre-charge device.

12. The sensing circuit of claim 11 , wherein the sense amplifier pre-charge device is coupled to a voltage source and is configured to switchably couple and decouple the sense amplifier to the voltage source according to the sense amplifier pre-charge control signal.

13. The sensing circuit of claim 12 , wherein the voltage source is approximately ground.

14. A memory array comprising:

a plurality of TCCT-based memory cells;

a sense amplifier;

a bit line coupled to the sense amplifier;

control circuitry configured to select an individual TCCT-based memory cell from the plurality of TCCT-based memory cells and to couple the individual TCCT-based memory cell to the bit line;

a reference cell;

a reference bit line coupled between the sense amplifier and the reference cell; and

a pre-charge device coupled to the bit line and configured to pre-charge the bit line.

15. The sensing circuit of claim 14 , wherein the sense amplifier includes

a memory node coupled to the bit line for receiving a memory signal from the individual TCCT-based memory cell, and

a reference node coupled to the reference bit line for receiving a reference signal from the reference cell; and

wherein the sense amplifier is configured to resolve the memory signal and the reference signal into complementary output signals.

16. The sensing circuit of claim 15 , further comprising a switchable memory node device coupled between the first node and the bit line.

17. The sensing circuit of claim 16 , wherein the memory node device is a MOSFET device.

18. The sensing circuit of claim 14 , wherein the pre-charge device includes a switchable pre-charge device to couple the bit line to a pre-charge node maintained at a substantially constant potential.

19. The sensing circuit of claim 18 , wherein the substantially constant potential is approximately ground.

20. The sensing circuit of claim 18 , wherein the switchable pre-charge device includes a MOSFET device.

21. The sensing circuit of claim 14 , wherein the sense amplifier includes two cross-coupled inverters.

22. The sensing circuit of claim 21 , wherein the sense amplifier further includes a switchable sensing source device coupled between the sense amplifier and a second potential to enable operation of the sense amplifier.

23. The sensing circuit of claim 14 , further comprising a sense amplifier pre-charge device coupled to the sense amplifier.

24. The sensing circuit of claim 23 , wherein a sense amplifier pre-charge control signal is used to control the sense amplifier pre-charge device.

25. The sensing circuit of claim 24 , wherein the sense amplifier pre-charge device is coupled to a voltage source and is configured to switchably couple and decouple the sense amplifier to the voltage source according to the sense amplifier pre-charge control signal.

26. The sensing circuit of claim 25 , wherein the voltage source is approximately ground.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2013
From: T-RAM SEMICONDUCTOR, INC.
To: T-RAM (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 031694/0018 →
PURCHASE OPTION AGREEMENT Recorded Jun 3, 2010
From: T-RAM SEMICONDUCTOR, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 024474/0979 →
RELEASE Recorded May 18, 2010
From: SILICON VALLEY BANK
To: T RAM SEMICONDUCTOR INCORPORATED
Reel/Frame 024492/0651 →
SECURITY AGREEMENT Recorded Aug 7, 2008
From: T-RAM SEMICONDUCTOR INCORPORATED
To: SILICON VALLEY BANK
Reel/Frame 021354/0186 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2002
From: YOON, SEI-SEUNG; JUNG, SEONG-OOK
To: T-RAM, INC.
Reel/Frame 013162/0352 →