IP Library › Patent Application 10212234
Patent Application Utility
App. No. 10/212,234 · Confirmation No. 2218

Method for forming a capping layer on a copper interconnect

Inventor: Koichi Ohto
Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2002-08-06 TRNA Transmittal of New Application 3 View
2002-08-06 ADS Application Data Sheet 3 View
2002-08-06 A.PE Preliminary Amendment 6 View
2002-08-06 SPEC Specification 9 View
2002-08-06 CLM Claims 3 View
2002-08-06 ABST Abstract 1 View
2002-08-06 DRW Drawings-only black and white line drawings 3 View
2002-08-06 OATH Oath or Declaration filed 2 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
10/212,234
Filed
2002-08-06
Pub. No.
US20020197865A1
Art Unit
2813