Patent Assignment
Reel/Frame 013650/0020
Assignment of Assignor's Interest
Recorded: 2003-05-13
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(8)
Circuit Device with Bonding Strength Improved and Method of Manufacturing the Same
Patent:
6,486,562 →
Application:
09/588,357 →
Semiconductor Device with P-N Junction Diode and Method of Forming the Same
Patent:
6,495,888 →
Application:
09/653,361 →
Semiconductor device and method for manufacturing the same
Application:
09/822,237 →
Publication:
US 2003/0205765
Method of Manufacturing a Semiconductor Device Having a T-Shaped Floating Gate
Manufacturing Method of Semiconductor Device
Flip-chip-type semiconductor device and manufacturing method thereof
Application:
10/147,903 →
Publication:
US 2002/0171152
Method of manufacturing semiconductor device
Application:
10/170,650 →
Publication:
US 2003/0059993
Method for forming a capping layer on a copper interconnect
Application:
10/212,234 →
Publication:
US 2002/0197865
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2000
From: KATO, KANEYUKI
To: NEC CORPORATION
Reel/Frame 010850/0507 →
Assignment of Assignor's Interest
Aug 31, 2000
From: YAMATO, HIDEKAZU
To: NEC CORPORATION
Reel/Frame 011070/0148 →
Assignment of Assignor's Interest
Apr 2, 2001
From: MASUOKA, SADAAKI
To: NEC CORPORATION
Reel/Frame 011664/0945 →
Assignment of Assignor's Interest
Mar 6, 2002
From: WAKABAYASHI, MASARU
To: NEC CORPORATION
Reel/Frame 012671/0241 →
Assignment of Assignor's Interest
May 20, 2002
From: MIYAZAKI, TAKASHI
To: NEC CORPORATION
Reel/Frame 012921/0660 →
Assignment of Assignor's Interest
Jun 14, 2002
From: FUKASAKU, KATSUHIKO
To: NEC CORPORATION
Reel/Frame 013002/0113 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0959 →
Change of Name
Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0530 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →