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App. No. 10/147,903 · Confirmation No. 4334

Flip-chip-type semiconductor device and manufacturing method thereof

Inventor: Takashi Miyazaki
Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2002-05-20 TRNA Transmittal of New Application 2 View
2002-05-20 ADS Application Data Sheet 3 View
2002-05-20 SPEC Specification 34 View
2002-05-20 CLM Claims 5 View
2002-05-20 ABST Abstract 1 View
2002-05-20 DRW Drawings-only black and white line drawings 14 View
2002-05-20 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/147,903
Filed
2002-05-20
Pub. No.
US20020171152A1
Art Unit
2826