Assignment of Assignor's Interest

Recorded: 2002-05-20 Pages: 2

Assignor

MIYAZAKI, TAKASHI

Executed: 2002-05-08

Assignee

NEC CORPORATION

MINATO-KU, 7-1, SHIBA 5-CHOME, TOKYO, JAPAN

Covered Property (1)

Flip-chip-type semiconductor device and manufacturing method thereof

Application: 10/147,903 →

Publication: US 2002/0171152

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.