Granted Patent
Utility
US 6,583,050
· Confirmation No. 4738
SEMICONDUCTOR WAFER WITH IMPROVED FLATNESS, AND PROCESS FOR PRODUCING THE SEMICONDUCTOR WAFER
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-08-13 | TRNA |
Transmittal of New Application | 9 | View | |
| 2002-08-13 | A.PE |
Preliminary Amendment | 3 | View | |
| 2002-08-13 | SPEC |
Specification | 26 | View | |
| 2002-08-13 | CLM |
Claims | 4 | View | |
| 2002-08-13 | ABST |
Abstract | 1 | View | |
| 2002-08-13 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2002-08-13 | OATH |
Oath or Declaration filed | 4 | View |
Inventors
Guido Wenski
Burghausen, GERMANY
Thomas Altmann
Burghausen, GERMANY
Ernst Feuchtinger
Wittibreut, GERMANY
Willibald Bernwinkler
Anzenkirchen, GERMANY
Wolfgang Winkler
Tittmoning, GERMANY
Gerhard Heier
Burghausen, GERMANY
Attorneys & Agents of Record
Classification
USPC
438/626
H10P52/00
H10P90/129
B24B37/042
B24B37/08
Prosecution
- Examiner
- DANG, PHUC T
- Art Unit
- 2818
- Docket No.
- WENSKI ET AL - 2
- Confirmation No.
- 4738
Foreign Priority
199 05 737.0
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1999-02-11
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GERMANY
Publication
- Pub. No.
- US20030045089A1
- Pub. Date
- 2003-03-06
Patent Term Adjustment
0days
CHANGE OF NAME
Recorded 2004-07-30
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Quick Facts
- Patent No.
- US 6,583,050
- App. No.
- 10/218,006
- Filed
- 2002-08-13
- Granted
- 2003-06-24
- Pub. No.
- US20030045089A1
- Examiner
- DANG, PHUC T
- Art Unit
- 2818
- PTA
- 0 days
External Links