IP Library Granted Patent US 6,583,050
Granted Patent Utility
US 6,583,050 · Confirmation No. 4738

SEMICONDUCTOR WAFER WITH IMPROVED FLATNESS, AND PROCESS FOR PRODUCING THE SEMICONDUCTOR WAFER

⬇ PDF
Code Description Pages PDF
2002-08-13 TRNA Transmittal of New Application 9 View
2002-08-13 A.PE Preliminary Amendment 3 View
2002-08-13 SPEC Specification 26 View
2002-08-13 CLM Claims 4 View
2002-08-13 ABST Abstract 1 View
2002-08-13 DRW Drawings-only black and white line drawings 4 View
2002-08-13 OATH Oath or Declaration filed 4 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,583,050
App. No.
10/218,006
Filed
2002-08-13
Granted
2003-06-24
Pub. No.
US20030045089A1
Examiner
DANG, PHUC T
Art Unit
2818
PTA
0 days