IP Library Granted Patent US 6,875,306
Granted Patent B2
US 6,875,306 · App. 10/218,406 · Granted Apr 5, 2005

Vacuum processing device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,875,306
App. No.
10/218,406
Granted
Apr 5, 2005
Kind
B2
Abstract

A vacuum processing device includes at least one vacuum processing chamber for performing predetermined treatments to a wafer being transferred to a predetermined position within the chamber, an atmospheric transfer equipment for transferring a wafer in atmospheric air to a vacuum transfer equipment which is disposed within a vacuum transfer chamber connecting the atmospheric air and the vacuum processing chambers for transferring the wafer received from the atmospheric transfer equipment to the predetermined position within the vacuum processing chamber, and wafer position sensors disposed near the ingress path leading into the processing chamber for detecting the displacement of the wafer being transferred.

Claims (10)

1. A vacuum processing device comprising:

atmospheric transfer equipment disposed in an atmospheric transfer unit for transferring a wafer in air;

a vacuum processing chamber for performing a predetermined treatment to a wafer transferred to and located on a predetermined position;

a vacuum transfer equipment disposed within a vacuum transfer chamber connecting the atmospheric transfer unit and the vacuum processing chamber, for transferring the wafer received from the atmospheric transfer equipment to said predetermined position within the vacuum processing chamber;

a wafer position sensor disposed near an ingress path of the wafer leading to the vacuum processing chamber for detecting an actual position of the wafer being transferred by the vacuum transfer equipment, for comparing a correct position of the wafer passing a line which is predetermined in advance, and for sensing a displacement of the actual position of the wafer being transferred from the correction position thereof in a transverse direction with respect to the traveling direction; and

a correction means for correcting the displacement of said wafer by moving an arm of the vacuum transfer equipment in the transverse direction with respect to the traveling direction based on the result of detection performed by said wafer position sensor.

2. A vacuum processing device according to claim 1 , wherein

the wafer position sensor comprises at least three optical sensors for sensing a rim position of the wafer being transferred by the vacuum transfer equipment.

3. A vacuum processing device according to claim 1 , wherein

an initial positioning of the wafer is performed using a unit disposed in atmosphere, and the displacement of the wafer is detected using a unit of the wafer position sensor disposed directly before a stage within the vacuum processing chamber.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2002
From: TAMURA, NAOYUKI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 013200/0785 →