IP Library Granted Patent US RE38,588
Granted Patent Re-Issue
US RE38,588 · Confirmation No. 4163

LEAD MATERIAL FOR ELECTRONIC PART, LEAD AND SEMICONDUCTOR DEVICE USING THE SAME

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Code Description Pages PDF
2005-04-25 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-01-06 IFEE Issue Fee Payment (PTO-85B) 2 View
2003-09-25 OATH Oath or Declaration filed 2 View
2002-08-14 TRNA Transmittal of New Application 5 View
2002-08-14 A.PE Preliminary Amendment 6 View
2002-08-14 SPEC Specification 6 View
2002-08-14 CLM Claims 1 View
2002-08-14 ABST Abstract 2 View
2002-08-14 DRW Drawings-only black and white line drawings 2 View
2002-08-14 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US RE38,588
App. No.
10/218,559
Filed
2002-08-14
Granted
2004-09-14
Examiner
XU, LING X
Art Unit
1775
PTA
0 days